Numerical simulation of vacuum arc and anode thermal process during the interruption process of HVDC vacuum switch with forced current zero

Author(s):  
Jing Jiang ◽  
Lijun Wang ◽  
Ze Yang ◽  
Jiagang Li ◽  
Ming Luo ◽  
...  
1991 ◽  
Vol 226 ◽  
Author(s):  
Wang Chunqing ◽  
Qian Yiyu ◽  
Jiang Yihong

AbstractIn this paper,a numerical simulation of thermal process in the SMT laser microsoldering joint has been developed, in which, the influence on thermal process of the factors such as the thermal conductivity variation of solder with temperature, light reflection coefficient of the lead wire surface, and heat exchange on the surface of SMT materials all have been considered. In order to carry this numerical calculation practice and prove it's results,the reflexive characteristic of light wave to the SMT materials has been gauged,and the dynamic temperature process of laser microjoint has been measured by a new experimental method which was invented by the authors.The results of numerical simulation have been borne out by the tests, and the influences of heating parameters on thermal process has been analysed in this paper.The conclusions will be advantageous to the further study of the microjoint quality control in the SMT laser microsoldering.


2021 ◽  
Vol 28 (12) ◽  
pp. 123513
Author(s):  
Shixin Xiu ◽  
Yuzi Jiang ◽  
Zixi Liu ◽  
Zhanpeng Liu ◽  
Jinwang Yang ◽  
...  

2007 ◽  
Vol 9 (6) ◽  
pp. 661-665 ◽  
Author(s):  
Wang Lijun ◽  
Jia Shenli ◽  
Shi Zongqian ◽  
Zhang Ling ◽  
Rong Mingzhe

2005 ◽  
Vol 38 (7) ◽  
pp. 1034-1041 ◽  
Author(s):  
Lijun Wang ◽  
Shenli Jia ◽  
Zongqian Shi ◽  
Mingzhe Rong

IEEE Access ◽  
2020 ◽  
Vol 8 ◽  
pp. 143085-143094
Author(s):  
Ziang Tong ◽  
Jianwen Wu ◽  
Kui Li

2011 ◽  
Vol 16 (3) ◽  
pp. 272-276 ◽  
Author(s):  
Xiao-hua Zhao ◽  
Jin-shan Li ◽  
Zhi-jun Yang ◽  
Hong-chao Kou ◽  
Rui Hu ◽  
...  

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