Hardware Efficient Built-in Self-test Architecture for Power and Ground TSVs in 3D IC
Keyword(s):
International Journal of Advanced Research in Electrical Electronics and Instrumentation Engineering
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2014 ◽
Vol 03
(11)
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pp. 12864-12870
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Keyword(s):
2005 ◽
Vol 54
(1)
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pp. 69-78
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