Quality Control of Trench Field Plate Power MOSFETs by Correlation of Trench Angle and Wafer Warpage

2020 ◽  
Author(s):  
Hiroaki Kato ◽  
Toshifumi Nishiguchi ◽  
Saya Shimomura ◽  
Katsura Miyashita ◽  
Kenya Kobayashi
Keyword(s):  
Quality Control ◽  
Power Mosfets ◽  
Field Plate

Correlation between Trench Angle and Wafer Warpage in Trench Field Plate Power MOSFETs and Its Application to Quality Control

2021 ◽  
pp. 1-1
Author(s):  
Hiroaki Kato ◽  
Toshifumi Nishiguchi ◽  
Saya Shimomura ◽  
Katsura Miyashita ◽  
Kenya Kobayashi
Keyword(s):  
Quality Control ◽  
Power Mosfets ◽  
Field Plate

New Process Integration of Sequential Phosphorus-Doped Silicon for Trench Field Plate Power MOSFETs

2021 ◽  
pp. 1-1
Author(s):  
Kota Tomita ◽  
Tatsuya Shiraishi ◽  
Hiroaki Kato ◽  
Hiroyuki Kishimoto ◽  
Katsura Miyashita ◽  
...  
Keyword(s):  
Process Integration ◽  
Power Mosfets ◽  
Field Plate ◽  
New Process ◽  
Doped Silicon ◽  
Phosphorus Doped

On-Resistance Limit Estimation of 100 V-class Field-Plate Trench Power MOSFETs Optimized Oxide Thickness

2020 ◽  
Vol 41 (7) ◽  
pp. 1063-1065
Author(s):  
Taichi Ogawa ◽  
Wataru Saito ◽  
Shin-Ichi Nishizawa
Keyword(s):  
Oxide Thickness ◽  
Power Mosfets ◽  
Class Field ◽  
Field Plate
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