Phase Array Ultrasonic Transducer Based on a Flip Chip Bonding with Indium Solder Bump
Keyword(s):
2003 ◽
Vol 150
(10)
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pp. C730
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2002 ◽
Vol 43
(6)
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pp. 1336-1340
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Keyword(s):
2007 ◽
Vol 30
(1)
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pp. 27-33
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Keyword(s):
2009 ◽
Vol 32
(2)
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pp. 261-267
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1995 ◽
Vol 34
(Part 1, No. 8A)
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pp. 4043-4046
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