An analytic expression of thermal diffusion coefficient for the hydrodynamic simulation of semiconductor devices

2002 ◽  
Author(s):  
T.-W. Tang ◽  
X. Wang ◽  
H. Gan ◽  
M.-K. Leong
Keyword(s):  
Diffusion Coefficient ◽  
Thermal Diffusion ◽  
Semiconductor Devices ◽  
Hydrodynamic Simulation ◽  
Thermal Diffusion Coefficient ◽  
Analytic Expression

scholarly journals An Analytic Expression of Thermal Diffusion Coefficient for the Hydrodynamic Simulation of Semiconductor Devices

VLSI Design ◽  
2001 ◽  
Vol 13 (1-4) ◽  
pp. 131-134 ◽  
Author(s):  
Ting-Wei Tang ◽  
Xinlin Wang ◽  
Haitao Gan ◽  
Meikei Ieong
Keyword(s):  
Diffusion Coefficient ◽  
Thermal Diffusion ◽  
Transport Coefficient ◽  
Semiconductor Devices ◽  
Temperature Dependent ◽  
Hydrodynamic Simulation ◽  
Thermal Diffusion Coefficient ◽  
Analytical Expression ◽  
Analytic Expression

A new analytical expression of thermal diffusion coefficient DT is derived. To the firstorder approximation, it is given by (1+η)-1(D/Tn) rather than (1–η)(D/Tn) where η=–(Tn/η*)(∂η*/∂Tn ) and η* represents the temperature-dependent bulk mobility. This new transport coefficient is implemented in our 2-D hydrodynamic device simulator and it seems to produce more reasonable results.

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