Coplanar waveguides fabricated by directly bonding metal foils to high-resistivity Si substrates

Author(s):  
Kenya Yonekura ◽  
Tasuku Kawamoto ◽  
Jianbo Liang ◽  
Eiji Shikoh ◽  
Koichi Maezawa ◽  
...  
Author(s):  
R. E. Amaya ◽  
V. Levenets ◽  
N. G. Tarr ◽  
C. Plett

1995 ◽  
Vol 67 (18) ◽  
pp. 2624-2626 ◽  
Author(s):  
T. Pfeifer ◽  
H.–M. Heiliger ◽  
E. Stein von Kamienski ◽  
H. G. Roskos ◽  
H. Kurz

1995 ◽  
Vol 39 ◽  
pp. 155-164
Author(s):  
Naoki Yamamoto

A fluorescent and diffracted X-ray spectrometer with an X-ray sub-micron beam was developed for the analysis of stress, crystal structure, and contamination in micro-regions of ULSIs. A fine glass capillary with a parabolic cross-sectional inner wall surface was made to form a micro X-ray beam. A micro-focus X-ray generator with a membrane-type target was also developed for use with the capillary. The equipment was used to analyze the crystal phases of Ti silicide fine lines and the strains in Al interconnections.The resistance of Ti-silicide lines increases the line width narrows under about 0.5 μrn. This is because of the growth of crystal phases of TiSi2(C49) and TiSi(B27) with high resistivity ﹛60 to 100 μΩ-cm).Hillocks of Al grow at line edges when Al layers are compressed by Si substrates and surrounding insulating layers. On the other hand, when the Al is extended by these layers, voids form in the AI lines.


2005 ◽  
Vol 44 (5) ◽  
pp. 436-439 ◽  
Author(s):  
Taeksoo Ji ◽  
Hargsoon Yoon ◽  
Jose K. Abraham ◽  
Vijay K. Varadan

2004 ◽  
Vol 52 (4) ◽  
pp. 1292-1301 ◽  
Author(s):  
J. Papapolymerou ◽  
G.E. Ponchak ◽  
E. Dalton ◽  
A. Bacon ◽  
M.M. Tentzeris

2014 ◽  
Vol 61 (1) ◽  
pp. 611-618 ◽  
Author(s):  
X. Wu ◽  
J. Harkonen ◽  
J. Kalliopuska ◽  
E. Tuominen ◽  
T. Maenpaa ◽  
...  

1988 ◽  
Vol 126 ◽  
Author(s):  
George W. Turner ◽  
H. K. Choi ◽  
J. P. Mattia ◽  
C. L. Chen ◽  
S. J. Eglash ◽  
...  

ABSTRACTThe recent demonstrations of room-temperature cw operation of diode lasers fabricated in GaAs/AlGaAs layers grown on Si wafers have encouraged efforts to develop monolithic GaAs/Si integration technology for applications such as optical interconnects between VLSI subsystems. This paper summarizes our current work in this area, which is focused on the development of a highspeed, MSI-scale monolithic GaAs/Si test chip that integrates Si MOSFET circuits with diode lasers, LEDs, photoconductive detectors, and MESFET logic circuits fabricated in GaAs/AlGaAs layers grown by molecular beam epitaxy. Growth issues and processing considerations that affect device and circuit performance are addressed, and the characteristics of LEDs monolithically integrated with Si driver circuits and of GaAs microwave MESFETs fabricated on high-resistivity Si substrates are reported.


1996 ◽  
Vol 31 (1-4) ◽  
pp. 385-395 ◽  
Author(s):  
T. Pfeifer ◽  
H.-M. Heiliger ◽  
T. Löffler ◽  
H.G. Roskos ◽  
H. Kurz

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