Power dissipation of chip-scale atomic clocks is one of the major design considerations. The largest power dissipation is for temperature control of the vertical-cavity surface-emitting laser (VCSEL) and cesium vapor cell. For example, the temperature of the VCSEL and Cs cell have to both be at 70±0.1°C or there will be frequency shift which will ruin the lock of the clock. These temperatures have to be maintained even under a large temperature variation such as −40°C to 50°C. There are three major thermal designs to consider: a) micro-heaters to fine-tune the temperatures of VCSEL and Cs cell, b) use of waste heat from other units to heat the system when outside temperature is low, and c) use of a thermal switch to release any extra waste heat when ambient temperatures are high. These three thermal designs have been incorporated in to a thermal test vehicle, which will be used to develop a thermal management design for the clock. This paper describes the proposed clock design, creation of the thermal test vehicle and development of a bimetallic snap based thermal conduction switch. The switch has been demonstrated to change thermal resistance from 52.9±2.8 K/W when the switch is open to 19.5±1.1 K/W with the switch closed.
