A multi-step DRIE process for a 128 × 128 micromirror array

Author(s):  
N. Kouma ◽  
O. Tsuboi ◽  
Y. Mizuno ◽  
H. Okuda ◽  
X. Mi ◽  
...  
Keyword(s):  
2003 ◽  
Author(s):  
D. B. Beasley ◽  
Matt Bender ◽  
Jay Crosby ◽  
Tim Messer ◽  
Daniel A. Saylor
Keyword(s):  

1999 ◽  
Author(s):  
Bumkyoo Choi ◽  
Junghoon Lee ◽  
Kyuwon Jung ◽  
Hyungjae Shin
Keyword(s):  

Author(s):  
C. C. Wang ◽  
T. D. Kudrle ◽  
M. Bancu ◽  
J. Hsiao ◽  
C. H. Mastrangelo

A method for the construction of high density (2.4 mm−2) vertical leads through a pyrex substrate is presented. The pyrex substrate behaves as a TCE (Thermal Coefficient of Expansion) matched interposer that permits anodic bonding of silicon micromirrors on one side and flip-chip bumping of multiplexing electronic chips on its opposite side. Electrical leads consist of 250±25 μm-diameter holes formed by AJM machining and coated with evaporated Au yielding via resistances of 0.5–0.7 Ω. The via holes are sealed with a new spin-cast polyimide tenting process that enables the subsequent patterning of multiple levels of metal using conventional lithographic techniques.


2007 ◽  
Vol 135 (1) ◽  
pp. 80-85 ◽  
Author(s):  
A. Nakai ◽  
K. Hoshino ◽  
K. Matsumoto ◽  
I. Shimoyama

2015 ◽  
Vol 35 (11) ◽  
pp. 1111002
Author(s):  
邢莎莎 Xing Shasha ◽  
冉英华 Ran Yinghua ◽  
江海波 Jiang Haibo ◽  
邢廷文 Xing Tingwen

2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Jan Kappa ◽  
Dominik Sokoluk ◽  
Steffen Klingel ◽  
Corey Shemelya ◽  
Egbert Oesterschulze ◽  
...  

2004 ◽  
Vol 29 (22) ◽  
pp. 2581 ◽  
Author(s):  
Guangya Zhou ◽  
VJ Logeeswaran ◽  
Fook Siong Chau ◽  
Francis E. H. Tay
Keyword(s):  

2009 ◽  
Author(s):  
Quan Sun ◽  
Ming Cai ◽  
Ningyuan Wang ◽  
Edmond Cretu

2002 ◽  
Vol 13 (1) ◽  
pp. 18-25 ◽  
Author(s):  
Kook-Nyung Lee ◽  
Dong-Sik Shin ◽  
Yoon-Sik Lee ◽  
Yong-Kweon Kim

Author(s):  
Amanda R. Hendrix ◽  
Brian T. Fleming ◽  
Eric Schindhelm ◽  
Rachel M. Tyler ◽  
Emily M. Witt ◽  
...  

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