2D numerical simulation of capacitively coupled RF plasma shower device

Author(s):  
M. Atanasova ◽  
G. Degrez ◽  
E. Benova ◽  
E. A. D. Carbone ◽  
D. Mihailova ◽  
...  
2012 ◽  
Vol 516-517 ◽  
pp. 917-920
Author(s):  
Xue Yao Wang ◽  
Xue Zhi Wu ◽  
Sheng Dian Wang ◽  
Xiang Xu ◽  
Yun Han Xiao

The flow character in riser is important for deep understanding the steady and high-efficient running of CFBs. In this paper, the 2D numerical simulation research for bench-scale circular cross-section riser based on EMMS methods is carried out. The solids’ transient moving profiles are captured. By analyzing the axial solids concentration profiles by simulation and experimental methods, the practicability of the EMMS model is verified.


2019 ◽  
Vol 134 ◽  
pp. 103444 ◽  
Author(s):  
I. Echeverribar ◽  
M. Morales-Hernández ◽  
P. Brufau ◽  
P. García-Navarro

2019 ◽  
Vol 10 (1) ◽  
pp. 151-159
Author(s):  
Jacqueline Furlan ◽  
Jairo Aparecido Martins ◽  
Estaner Claro Romão

2016 ◽  
Vol 861 ◽  
pp. 401-408
Author(s):  
Lucie Horká ◽  
Jan Weyr

This study is aimed at parametric analysis of floor cooling. Impact of several design parameters such as air temperature, temperature of cooling water, distance of cooling pipes, thickness and thermal conductivity of top layer on total heat transfer of cooling floor is studied. The issue is solved by steady-state 2D numerical simulation of heat transfer to the floor construction. These parametric simulations are performed in software CalA. Impact of variable input parameters on total heat transfer is observed. Results of parametric analysis are displayed in a nomogram. This nomogram is useful for faster designing of floor cooling.


1990 ◽  
Vol 192 ◽  
Author(s):  
Yoshihiro Hishikawa ◽  
Sadaji Tsuge ◽  
Noboru Nakamura ◽  
Shinya Tsuda ◽  
Shoichi Nakano ◽  
...  

ABSTRACTWide-gap a-Si:H films with device quality (Tauc’s optical gap > 1.9eV, σph under AMI.5, 100mW/cm2 illumination ≥ 10−5, Ω−1cm−1, a σph/σ a≥106) have been fabricated. These films are deposited at low substrtate temperatures (TS≤80°C ) either by diluting SiH4 with H2 or optimizing the plasma parameters in a capacitively–coupled RF plasma–CVD reactor. Reduction in the SiH2 bond density and the ESR spin density are also observed. In this study, good film quality is always accompanied by a small deposition rate. Furthermore, σph is nearly the same if the deposition rate and Ts is the same, regardless of other deposition parameters. This suggests that the surface reactions or structural relaxations at the film-growing surface can produce high–quality a–Si:H films even at low TsS, if the deposition rate is low. Results in thermal annealing, light exposure, and solar cell performance confirm that these films have device quality and wide bandgap.


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