Test structures and DRIE topography for bulk silicon MEMS devices

2004 IEEE International Reliability Physics Symposium. Proceedings ◽

10.1109/relphy.2004.1315424 ◽

2004 ◽

Author(s):

Yong Ruan ◽

Dacheng Zhang ◽

Xuefeng He ◽

Yangyuan Wang

Keyword(s):

Mems Devices ◽

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Electrical isolation of bulk silicon MEMS devices via thermomigration

Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) ◽

10.1109/memsys.2000.838507 ◽

2002 ◽

Author(s):

C.C. Chung ◽

M.G. Allen

Keyword(s):

Mems Devices ◽

Bulk Silicon ◽

Electrical Isolation

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Etch Time Optimization in Bulk Silicon MEMS Devices Using a Novel Compensation Structure

Lecture Notes in Electrical Engineering - Microelectronics, Electromagnetics and Telecommunications ◽

10.1007/978-981-10-7329-8_4 ◽

2018 ◽

pp. 33-40 ◽

Author(s):

J. Grace Jency ◽

M. Sekar ◽

A. Ravi Sankar

Keyword(s):

Mems Devices ◽

Bulk Silicon ◽

Compensation Structure ◽

Time Optimization ◽

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Design and fabrication of MEMS devices using the integration of MUMPs, trench-refilled molding, DRIE and bulk silicon etching processes

Journal of Micromechanics and Microengineering ◽

10.1088/0960-1317/15/3/014 ◽

2004 ◽

Vol 15 (3) ◽

pp. 535-542 ◽

Author(s):

Mingching Wu ◽

Weileun Fang

Keyword(s):

Silicon Etching ◽

Mems Devices ◽

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Thermomigration-Based Junction Isolation of Bulk Silicon MEMS Devices

Journal of Microelectromechanical Systems ◽

10.1109/jmems.2005.879685 ◽

2006 ◽

Vol 15 (5) ◽

pp. 1131-1138 ◽

Author(s):

C.C. Chung ◽

M.G. Allen

Keyword(s):

Mems Devices ◽

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Deposition and Characterization of Al2O3 and BiFeO3 Thin Films on Titanium Substrates for Tough MEMS Devices

IEEJ Transactions on Sensors and Micromachines ◽

10.1541/ieejsmas.137.46 ◽

2017 ◽

Vol 137 (1) ◽

pp. 46-47

Author(s):

Takeshi Kohno ◽

Masato Mihara ◽

Ataru Tanabe ◽

Takashi Abe ◽

Masanori Okuyama ◽

...

Keyword(s):

Mems Devices ◽

Titanium Substrates

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MITIGATION OF FLOW AND THERMAL NON-UNIFORMITY IN MEMS DEVICES: NUMERICAL INVESTIGATION

Proceeding of Proceedings of the 25th National and 3rd International ISHMT-ASTFE Heat and Mass Transfer Conference (IHMTC-2019) ◽

10.1615/ihmtc-2019.450 ◽

2019 ◽

Author(s):

Mangal Singh Lodhi ◽

Tanuja Sheorey ◽

Goutam Dutta

Keyword(s):

Numerical Investigation ◽

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Research in Mechanics of MEMS Devices

10.21236/ada382871 ◽

2000 ◽

Author(s):

D. J. Chang ◽

S. T. Amimoto ◽

A. D. Birkitt

Keyword(s):

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Actuator for Out-of-Plane MEMS Devices

10.21236/ada390338 ◽

2001 ◽

Author(s):

A. D. Johnson ◽

Vikas Gupta

Keyword(s):

Mems Devices ◽

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Control of Transition in Swept-Wing Boundary Layers Using MEMS Devices as Distributed Roughness

10.21236/ada388392 ◽

1997 ◽

Author(s):

William S. Saric

Keyword(s):

Boundary Layers ◽

Mems Devices ◽

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A Static Technique for the Electro-Mechanical Characterization of Organic MEMS Devices for RF and Microwave Applications

10.21236/ada405902 ◽

2002 ◽

Author(s):

Anupama B. Kaul ◽

Tomasz Klosowiak ◽

Joshua Liu

Keyword(s):

Mechanical Characterization ◽

Mems Devices ◽

Microwave Applications ◽

Static Technique

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