Thermal and mechanical finite element analysis of a VLSI package including spatially varying thermal contact resistance

Author(s):  
B.R. Simon ◽  
Y. Yuan ◽  
J.R. Umaretiya ◽  
R. Bavirisetty ◽  
J.L. Prince
2012 ◽  
Vol 326-328 ◽  
pp. 482-487 ◽  
Author(s):  
S. Oukach ◽  
Bernard Pateyron ◽  
H. Hamdi ◽  
M. El Ganaoui

In this paper, a Finite Element Analysis is carried out in order to simulate the process of spreading and solidification of a micrometric molten droplet impinging onto a cold substrate. This process is a crucial key to have a good understanding of coatings obtained by means of thermal spraying. The effect of thermal contact resistance (TCR) on the droplet spreading and solidification was investigated using different values of TCR and different droplet sizes. The solidification time was found to be a linear function of the droplet diameter square. Viscous dissipation, wettability and surface tension effects are taken into account. The Level Set method was employed to explicitly track the free surface of molten droplets.


2002 ◽  
Vol 124 (4) ◽  
pp. 457-464 ◽  
Author(s):  
Toshimichi Fukuoka ◽  
Quantuo Xu

The tightening operation with a bolt heater has advantages surpassing those of other tightening methods. Currently, a bolt heater is mainly applied to tighten huge bolts that cannot be clamped by other means, and the tightening operation is usually supported by the expertise of skilled workers. In this paper, a numerical approach is presented to aim at a broader use of bolt heater technique by elucidating the tightening mechanism. The effects of thermal contact resistance existing around a bolted joint are taken into account for a better accuracy in the numerical analyses. Based on the numerical results obtained, a series guideline to help the tightening operation when performed by less skilled workers is proposed.


Author(s):  
M. K. Thompson

Many traditional macro scale finite element models of thermal contact systems have incorporated the effect of micro scale surface topography by applying a constant value of thermal contact conductance (TCC) per unit area to the regions in contact. However, it has been very difficult to determine an appropriate TCC value for a given system and analysts typically had to rely on experimental data or values from the literature. This work presents a method for predicting micro scale TCC per unit area by incorporating micro scale surface roughness in a multi-scale iterative thermal/structural finite element contact model. The resulting TCC value is then used in a macro scale thermal/structural contact model with apparent surface form to predict the thermal contact resistance and overall thermal resistance for a commercial power electronics module.


2012 ◽  
Vol 538-541 ◽  
pp. 730-734
Author(s):  
Bing Fang ◽  
Lei Zhang ◽  
Jian Fu Zhang ◽  
Ya Hong Li

This paper presented a real-time measuring method of temperature fields and thermal deformations in vertical machining center. And a FEA model including the thermal contact resistance at interface for evaluating the temperature distribution and tools deformation in vertical machining center (VMC) was established. Compared with the experiment results, it is shown that the new model is much more accurate than the traditional model without considering thermal contact resistance at interface.


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