Thermal and mechanical finite element analysis of a VLSI package including spatially varying thermal contact resistance
2016 ◽
Vol 106
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pp. 731-742
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2012 ◽
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pp. 482-487
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2002 ◽
Vol 124
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pp. 457-464
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2011 ◽
Vol 54
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pp. 666-674
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2012 ◽
Vol 538-541
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pp. 730-734