Spread of critical currents in thin-film YBa/sub 2/Cu/sub 3/O/sub 7-x/ bicrystal junctions and faceting of grain boundary

2003 ◽  
Vol 13 (2) ◽  
pp. 603-605 ◽  
Author(s):  
P. Shadrin ◽  
C.L. Jia ◽  
Y. Divin
Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.


2019 ◽  
Vol 7 (42) ◽  
pp. 13156-13160 ◽  
Author(s):  
Svetlana Sirotinskaya ◽  
Christian Fettkenhauer ◽  
Daichi Okada ◽  
Yohei Yamamoto ◽  
Doru C. Lupascu ◽  
...  

Introducing a modal system approach for the analytical perovskite thin-film trap physics evaluation. Our study confirms existing models for trap formation in MAPI, substantiating different defect states in the grain boundary and bulk regions.


2007 ◽  
Vol 17 (2) ◽  
pp. 3605-3607
Author(s):  
YongHwan Jung ◽  
Sunme Lim ◽  
Jaeun Yoo ◽  
SangMoo Lee ◽  
Yehyun Jung ◽  
...  

2019 ◽  
Vol 8 (1) ◽  
pp. 211-216
Author(s):  
Antonio Valletta ◽  
Alessandra Bonfiglietti ◽  
Matteo Rapisarda ◽  
Alessandro Pecora ◽  
Luigi Mariucci ◽  
...  

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