Mechanism Study of Ultrasonic-Vibration-Assisted Underfill Process for Flip-Chip Encapsulation

2016 ◽  
Vol 6 (11) ◽  
pp. 1711-1722 ◽  
Author(s):  
Hui Wang ◽  
Haiping Xiang ◽  
Xufei Hao ◽  
Zhenghua Meng ◽  
Lin Hua
Keyword(s):  
Ultrasonic Vibration ◽  
Flip Chip ◽  
Mechanism Study

Mechanism study of bubble removal in narrow viscous fluid by using ultrasonic vibration

2019 ◽  
Vol 58 (11) ◽  
pp. 115503 ◽  
Author(s):  
Hui Wang ◽  
Zhenyan Chen ◽  
Youming Chen ◽  
Mingjie Xie ◽  
Lin Hua
Keyword(s):  
Viscous Fluid ◽  
Ultrasonic Vibration ◽  
Mechanism Study ◽  
Bubble Removal

scholarly journals Effect of Direction of Ultrasonic Vibration on Flip-Chip Bonding

2013 ◽  
Vol 6 (1) ◽  
pp. 38-42 ◽  
Author(s):  
Mutsumi Masumoto ◽  
Yoshiyuki Arai ◽  
Hajime Tomokage
Keyword(s):  
Ultrasonic Vibration ◽  
Flip Chip ◽  
Flip Chip Bonding

Mechanism study on ultrasonic vibration assisted face grinding of Hard and brittle materials

2020 ◽  
Vol 50 ◽  
pp. 520-527 ◽  
Author(s):  
Xiaofeng Zhang ◽  
Lin Yang ◽  
Yan Wang ◽  
Bin Lin ◽  
Yinghuai Dong ◽  
...  
Keyword(s):  
Ultrasonic Vibration ◽  
Brittle Materials ◽  
Mechanism Study ◽  
Hard And Brittle Materials ◽  
Face Grinding

Mechanism study on microgroove forming by ultrasonic vibration assisted hot pressing

2016 ◽  
Vol 46 ◽  
pp. 270-277 ◽  
Author(s):  
Jiaqing Xie ◽  
Tianfeng Zhou ◽  
Yang Liu ◽  
Tsunemoto Kuriyagawa ◽  
Xibin Wang
Keyword(s):  
Ultrasonic Vibration ◽  
Hot Pressing ◽  
Mechanism Study
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