Fast and Accurate Power Distribution Network Modeling of a Silicon Interposer for 2.5-D/3-D ICs With Multiarray TSVs

Author(s):  
Kyungjun Cho ◽  
Joungho Kim ◽  
Youngwoo Kim ◽  
Subin Kim ◽  
Hyunwook Park ◽  
...  
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