Fast and Accurate Power Distribution Network Modeling of a Silicon Interposer for 2.5-D/3-D ICs With Multiarray TSVs
2019 ◽
Vol 9
(9)
◽
pp. 1835-1846
Keyword(s):
2013 ◽
Vol 20
(4)
◽
pp. 75-79
Keyword(s):
2017 ◽
Vol 27
(9)
◽
pp. 815-817
◽
Keyword(s):
2010 ◽
Vol 33
(3)
◽
pp. 647-659
◽