Journal of the Microelectronics and Packaging Society
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Published By The Korean Microelectronics And Packaging Society

1226-9360
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scholarly journals Study of high Speed Laser Cutting of LED Module

2017 ◽  
Vol 24 (1) ◽  
pp. 91-101
Author(s):  
Won Yong Choi ◽  
Sung-Hoon Choa
Keyword(s):  
Laser Cutting ◽  
High Speed

scholarly journals Transient Liquid Phase (TLP) Bonding of Device for High Temperature Operation

2017 ◽  
Vol 24 (1) ◽  
pp. 17-25
Author(s):  
Do-hyun Jung ◽  
Myung-hwan Roh ◽  
Jun-hyeong Lee ◽  
Kyung-heum Kim ◽  
Jae Pil Jung
Keyword(s):  
High Temperature ◽  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Tlp Bonding ◽  
High Temperature Operation

scholarly journals Soft Magnetic Property of Ternary Fe-9.8Si-6.0Al Alloy Using by Recycling Fe-Si Electrical Steel Sheet Scrap

2017 ◽  
Vol 24 (1) ◽  
pp. 1-8
Author(s):  
Won Sik Hong ◽  
Hyoung Woo Yang ◽  
Ji-Yeon Park ◽  
Chulmin Oh ◽  
Woo Sung Lee ◽  
...  
Keyword(s):  
Magnetic Property ◽  
Steel Sheet ◽  
Electrical Steel ◽  
Soft Magnetic Property ◽  
Soft Magnetic ◽  
Electrical Steel Sheet

scholarly journals Numerical Fatigue Life Prediction of IGBT Module for Electronic Locomotive

2017 ◽  
Vol 24 (1) ◽  
pp. 103-111
Author(s):  
Oh Young Kwon ◽  
Young Moon Jang ◽  
Young-ho Lee ◽  
Sung-Hoon Choa
Keyword(s):  
Fatigue Life ◽  
Life Prediction ◽  
Fatigue Life Prediction ◽  
Igbt Module
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