Power Distribution Network Modeling and Analysis for TSV and Interposer-Based 3D ICs in the Frequency Domain

2014 ◽  
pp. 173-224
Author(s):  
Kiyeong Kim ◽  
Jun So Pak ◽  
Joungho Kim
Keyword(s):  
Frequency Domain ◽  
Power Distribution ◽  
Network Modeling ◽  
Distribution Network ◽  
Power Distribution Network ◽  
Modeling And Analysis ◽  
3D Ics ◽  
Network Modeling And Analysis

Fast and Accurate Power Distribution Network Modeling of a Silicon Interposer for 2.5-D/3-D ICs With Multiarray TSVs

2019 ◽  
Vol 9 (9) ◽  
pp. 1835-1846
Author(s):  
Kyungjun Cho ◽  
Joungho Kim ◽  
Youngwoo Kim ◽  
Subin Kim ◽  
Hyunwook Park ◽  
...  
Keyword(s):  
Power Distribution ◽  
Network Modeling ◽  
Distribution Network ◽  
Power Distribution Network
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