Improvement of Electrochemical Migration Resistance by Cu/Sn Intermetallic Compound Barrier on Cu in Printed Circuit Board

2014 ◽  
Vol 14 (1) ◽  
pp. 382-389 ◽  
Author(s):  
Min-Suk Jung ◽  
Shin-Bok Lee ◽  
Ho-Young Lee ◽  
Chang-Sup Ryu ◽  
Young-Gwan Ko ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Electrochemical Migration ◽  
Printed Circuit ◽  
Migration Resistance

Electrochemical migration characteristics of eutectic SnPb solder alloy in printed circuit board

2006 ◽  
Vol 504 (1-2) ◽  
pp. 294-297 ◽  
Author(s):  
Shin-Bok Lee ◽  
Young-Ran Yoo ◽  
Ja-Young Jung ◽  
Young-Bae Park ◽  
Young-Sik Kim ◽  
...  
Keyword(s):  
Solder Alloy ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Electrochemical Migration ◽  
Printed Circuit ◽  
Snpb Solder ◽  
Eutectic Snpb

Humidity Threshold Model of Numerical Control Multilayer Printed Circuit Board for Electrochemical Migration

2014 ◽  
Vol 31 (4) ◽  
pp. 567-578 ◽  
Author(s):  
Chuanning Xie ◽  
Xiaoqi Tang ◽  
Jihong Chen ◽  
Bao Song ◽  
Jian Jin ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Threshold Model ◽  
Numerical Control ◽  
Circuit Board ◽  
Electrochemical Migration ◽  
Printed Circuit
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