Analytical and Finite-Element Modeling of a Cross Kelvin Resistor Test Structure for Low Specific Contact Resistivity

2009 ◽  
Vol 56 (10) ◽  
pp. 2250-2254 ◽  
Author(s):  
Anthony S. Holland ◽  
Geoffrey K. Reeves ◽  
Madhu Bhaskaran ◽  
Sharath Sriram
2005 ◽  
Author(s):  
Anthony S. Holland ◽  
Madhu Bhaskaran ◽  
Sharath Sriram ◽  
Geoffrey K. Reeves ◽  
Vykundh Ravichandran ◽  
...  

1986 ◽  
Vol 7 (8) ◽  
pp. 477-479 ◽  
Author(s):  
W.M. Loh ◽  
P.J. Wright ◽  
T.A. Schreyer ◽  
S.E. Swirhun ◽  
K.C. Saraswat ◽  
...  

2017 ◽  
Vol 30 (3) ◽  
pp. 313-326 ◽  
Author(s):  
Anthony Holland ◽  
Yue Pan ◽  
Mohammad Alnassar ◽  
Stanley Luong

Though the transport of charge carriers across a metal-semiconductor ohmic interface is a complex process in the realm of electron wave mechanics, such an interface is practically characterised by its specific contact resistance. Error correction has been a major concern in regard to specific contact resistance test structures and investigations by finite element modeling demonstrate that test structures utilising circular contacts can be more reliable than those designed to have square shaped contacts as test contacts become necessarily smaller. Finite element modeling software NASTRAN can be used effectively for designing and modeling ohmic contact test structures and can be used to show that circular contacts are efficient in minimising error in determining specific contact resistance from such test structures. Full semiconductor modeling software is expensive and for ohmic contact investigations is not required when the approach used is to investigate test structures considering the ohmic interface as effectively resistive.


2015 ◽  
Vol 28 (3) ◽  
pp. 457-464
Author(s):  
Aaron Collins ◽  
Yue Pan ◽  
Anthony Holland

We present a numerical method to extract specific contact resistivity (SCR) for three-dimensional (3-D) contact structures using a two-electrode test structure. This method was developed using Finite Element Modeling (FEM). Experimental measurements were performed for contacts of 200 nm nickel (Ni) to p+-type germanium (Ge) substrates and 200 nm of Titanium (Ti) on 4H-Silicon Carbide (SiC). The SCR obtained was (2.3-27)?10-6 ??cm2 for the Ni-Ge contacts and (1.3-2.4)?10-3 ??cm2 for the Ti-SiC.


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