3-D CMOS Chip Stacking for Security ICs Featuring Backside Buried Metal Power Delivery Networks With Distributed Capacitance
2010 ◽
Vol 58
(11)
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pp. 2940-2951
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Keyword(s):
2016 ◽
Vol 5
(5)
◽
pp. 349-357
◽
2016 ◽
Vol 10
(5)
◽
pp. 448-455
◽
Keyword(s):