Investigation of Complex Looping Process for Thermosonic Wire Bonding

2014 ◽  
Vol 27 (2) ◽  
pp. 238-245
Author(s):  
Fuliang Wang ◽  
Yun Chen ◽  
Lei Han
Keyword(s):  
Wire Bonding ◽  
Thermosonic Wire Bonding

Modeling and Experimental Study of a Wire Clamp for Wire Bonding

2015 ◽  
Vol 137 (1) ◽  
Author(s):  
Fuliang Wang ◽  
Dengke Fan
Keyword(s):  
Experimental Study ◽  
Finite Element ◽  
Energy Conservation ◽  
Design Process ◽  
Gold Wire ◽  
Wire Bonding ◽  
Fe Model ◽  
Amplification Ratio ◽  
Model Studies ◽  
Thermosonic Wire Bonding

A wire clamp is used to grip a gold wire with in 1–2 ms during thermosonic wire bonding. Modern wire bonders require faster and larger opening wire clamps. In order to simplify the design process and find the key parameters affecting the opening of wire clamps, a model analysis based on energy conservation was developed. The relation between geometric parameters and the amplification ratio was obtained. A finite element (FE) model was also developed in order to calculate the amplification ratio and natural frequency. Experiments were carried out in order to confirm the results of these models. Model studies show that the arm length was the major factor affecting the opening of the wire clamp.

Experimental Study of Kick up Phenomenon in Thermosonic Wire-Bonding

2012 ◽  
Vol 160 ◽  
pp. 77-81
Author(s):  
Jing Jing Tian ◽  
Lei Han
Keyword(s):  
Image Processing ◽  
Experimental Study ◽  
High Speed ◽  
Gold Wire ◽  
Wire Bonding ◽  
Processing Method ◽  
Experimental Results ◽  
High Speed Camera ◽  
Depth Study ◽  
Thermosonic Wire Bonding

Kick-up phenomenon during looping is an important factor in thermosonic wire bonding. In this study, the loping process during wire bonding was recorded by using high-speed camera, and wire profiles evolution was obtained from images sequence by image processing method. With a polynomial fitting, the wire loop profiling was described by the curvature changing, and kick-up phenomenon on gold wire was found between the instant of 290th frame(0.0537s) to 380th frame (0.0703s), the change of curvature is divided into three phases, a looping phase, a mutation phase and a kick-up phase. While in the kick-up phase, the kick up phenomenon is the most obvious. These experimental results were useful for in-depth study of kick-up phenomenon by simulation.

Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding

2011 ◽  
Vol 51 (1) ◽  
pp. 43-52 ◽  
Author(s):  
A. Pequegnat ◽  
H.J. Kim ◽  
M. Mayer ◽  
Y. Zhou ◽  
J. Persic ◽  
...  
Keyword(s):  
Flow Rate ◽  
Wire Bonding ◽  
Free Air ◽  
Thermosonic Wire Bonding
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