Molecular Dynamics Study on Interfacial Fracture of Aluminum Alloy and Epoxy Resin Adhesive Subjected to Cyclic Loading

2021 ◽  
Author(s):  
Kohei Kanamori ◽  
Yoshikatsu Kimoto ◽  
Akio Yonezu
Keyword(s):  
Molecular Dynamics ◽  
Aluminum Alloy ◽  
Cyclic Loading ◽  
Epoxy Resin ◽  
Interfacial Fracture ◽  
Resin Adhesive ◽  
Epoxy Resin Adhesive

Molecular Dynamics Study on Interfacial Fracture of Aluminum Alloy and Epoxy Resin Adhesive Subjected to Cyclic Loading

2020 ◽  
Author(s):  
Kohei Kanamori ◽  
Yoshikatsu Kimoto ◽  
Akio Yonezu
Keyword(s):  
Molecular Dynamics ◽  
Aluminum Alloy ◽  
Cyclic Loading ◽  
Strain Rate ◽  
Epoxy Resin ◽  
Adhesion Strength ◽  
Tensile Deformation ◽  
Critical Role ◽  
Interfacial Fracture ◽  
Curing Temperature

Abstract Direct bonding of metal-resin plays a critical role in jointing of dissimilar materials and the adhesion strength is known to be dependent on strain rate (loading rate) due to the strain rate sensitivity of polymeric resin. This study evaluated adhesion strength and adhesion durability against repetitive loading for the interface between aluminum alloy and epoxy resin. For experiment, a pulsed YAG laser was used to generate strong elastic waves, resulting in interfacial fracture. This method is called Laser Shock Adhesion Test (LaSAT), which enables us to evaluate impact strength of interfacial fracture. This study prepared two types of specimens with different curing temperature (20°C and 100°C). It is found that the specimen with higher temperature curing shows larger adhesion strength. Subsequently, repetitive LaSAT experiments (cyclic loading tests) were conducted to evaluate adhesion durability. This reveals that adhesion strength showed cyclic fatigue characteristics and higher curing temperature improves fatigue strength. To elucidate this mechanism at molecular level, molecular dynamics (MD) simulation was conducted for the interfacial material with epoxy resin. This study created all-atomistic model of Al2O3/epoxy resin interface, and repetitive tensile deformation was applied until delamination. It is found that the number of loading cycles to delamination was increased when the applied tensile stress was lower. It is also found that the 400K curing model showed larger adhesion strength than that of the 300K curing model. This trend is very similar with the results of LaSAT experiments. Our comprehensive study with LaSAT experiments and MD simulations evaluates adhesion strength of Al/epoxy interface and reveals its fracture mechanism.

scholarly journals Effect of Nonwoven Carbon Tissue-Reinforced Epoxy Resin Adhesive Layer on the Single Lap Bonding Strength of Aluminum Alloy Joints

ACS Omega ◽  
2021 ◽  
Vol 6 (37) ◽  
pp. 23802-23813
Author(s):  
Zhifeng Hu ◽  
Haijuan Kong ◽  
Lei Tao ◽  
Mengmeng Qiao ◽  
Dongzi Yu ◽  
...  
Keyword(s):  
Aluminum Alloy ◽  
Epoxy Resin ◽  
Bonding Strength ◽  
Adhesive Layer ◽  
Resin Adhesive ◽  
Epoxy Resin Adhesive

Analysis of the physcial properties of particleboard from a mixture of cocoa pod peel powder and styrofoam

2021 ◽  
Vol 5 (1) ◽  
pp. 7
Author(s):  
Ety Jumiati ◽  
Endang Sagita Ritonga ◽  
Abdul Halim Daulay
Keyword(s):  
Moisture Content ◽  
Physical Properties ◽  
Epoxy Resin ◽  
Powder Mixture ◽  
Surface Shape ◽  
Particle Board ◽  
Hot Press ◽  
Resin Adhesive ◽  
Cocoa Pod Husk ◽  
Epoxy Resin Adhesive

<p><strong><em>Abstract</em></strong><strong></strong></p><p><strong><em>Abstract. This study aims to determine the effect of optimal physical properties and microstructure on particleboard samples. The percentage variations of cocoa pod peel powder mixture, styrofoam with epoxy resin adhesive were sample A (69:0:30), sample B (68:2:30), sample C (67:3:30), and sample D (66:4:30). 6:30). The materials were compressed were a hot press and a conditioning time of 14 days. sThe most optimum particleboard sample was found in sample B with values of density, moisture content, and thickness expansion, respectively 0,80 g/cm</em></strong><strong><em><sup>2</sup></em></strong><strong><em>, 7,74%, and 9,32%, and met the standards of SNI 03-2105- 2006. The surface shape of the particle board morphology in sample B shows the composition of the material with the adhesive binding optimally so that there are very few empty spaces or cavities.</em></strong><strong></strong></p><h1 align="center"><em> </em></h1><p><strong><em>Keywords:</em></strong><em> cocoa pod husk powder, styrofoam, particle board, epoxy resin.</em></p>

Study on Nano-Particle Modified Epoxy Resin Adhesive

2011 ◽  
Vol 415-417 ◽  
pp. 35-38 ◽  
Author(s):  
Guang Qing Gai ◽  
Xiang Ting Dong ◽  
Xue Song Chen ◽  
Cheng Yan Zheng
Keyword(s):  
Mechanical Properties ◽  
Epoxy Resin ◽  
Nano Particles ◽  
Nano Particle ◽  
Resin Adhesive ◽  
Nano Zinc Oxide ◽  
Epoxy Resin Adhesive ◽  
Nano Zinc ◽  
Nano Titanium Dioxide ◽  
Modified Epoxy

The nano-particle modified epoxy resin adhesive was prepared by adding different types of nanoparticles to the epoxy resin adhesives.The influence of the kinds and amount of nanoparticles on the mechanical properties of epoxy resin adhesive was investigated.The investigation results indicated that the addition of three kinds of nanoparticles including nano-silica,nano-titanium dioxide,nano zinc oxide to epoxy resin adhesive has a significant influence on the mechanical properties of nano-composites.And tensile strength and breaking elongation of nano-composites reached the maximum when the amount of nanoparticle reached 4wt%.In addition,the toughening mechanisms of nano-particles modified epoxy resin adhesives was analysed.

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