Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach

1992 ◽  
Vol 114 (2) ◽  
pp. 152-160 ◽  
Author(s):  
A. Dasgupta ◽  
C. Oyan ◽  
D. Barker ◽  
M. Pecht
Keyword(s):  
Finite Element ◽  
Solder Joint ◽  
Fatigue Damage ◽  
Strain Range ◽  
Energy Partitioning ◽  
Stress Strain ◽  
Cyclic Temperature ◽  
Creep Fatigue ◽  
Solder Fatigue ◽  
Partitioning Technique

This study explores the possibility of using a unified theory of creep-fatigue, similar to the Halford-Manson strain-range partitioning method, for examining the effect of cyclic temperature range on fatigue life, over a wide range of temperatures. Other investigators have attempted similar techniques before for solder fatigue analysis. The present study is different since it proposes an energy-partitioning technique rather than strain-partitioning to examine the dependence of solder fatigue behavior on temperature dependent changes in the relative amounts of plastic and creep strains. The solder microstructure also dictates creep behavior but is assumed to be a given invariant parameter in this study. In other words, this study is targeted at as-cast microstructures and does not address post-recrystallization behavior. A sample solder joint of axisymmetric configuration, commonly found in leaded through-hole mounting technology, is analyzed with the help of nonlinear finite element methods. The strain history is determined for constant-amplitude temperature cycling with linear loading and unloading, and with constant dwells at upper and lower ends of the cycle. Large-deformation continuum formulations are utilized in conjunction with a viscoplastic constitutive model for the solder creep-plasticity behavior. Relevant material properties are obtained from experimental data in the literature. The results show significant amounts of rachetting and shakedown in the solder joint. Detailed stress-strain histories are presented, illustrating the strain amplitude, mean strain and residual stresses and strains. For illustrative purposes, the hysteresis cycles are partitioned into elastic, plastic and creep components. Such partitioned histories are essential in order to implement either the Halford-Manson strain-range partitioning technique or the energy-based approach suggested here, for analyzing the creep-fatigue damage accumulation in solder material. This study also illustrates the role and utility of the finite element method in generating the detailed stress-strain histories necessary for implementing the energy partitioning approach for creep-fatigue damage evaluation. Solder life prediction is presented as a function of cyclic temperature range at a given mean temperature.

Solder Creep-Fatigue Interactions With Flexible Leaded Parts

1992 ◽  
Vol 114 (2) ◽  
pp. 185-192 ◽  
Author(s):  
R. G. Ross ◽  
L. C. Wen ◽  
G. R. Mon ◽  
E. Jetter
Keyword(s):  
Computer Program ◽  
Strain Rate ◽  
Thermal Cycle ◽  
Failure Process ◽  
Strain Range ◽  
Strain Rate Effects ◽  
Rate Effects ◽  
Creep Fatigue ◽  
Solder Fatigue

With flexible leaded parts, the solder-joint failure process involves a complex interplay of creep and fatigue mechanisms. To better understand the role of creep in typical multi-hour cyclic loading conditions, a specialized non-linear finite-element creep simulation computer program has been formulated. The numerical algorithm includes the complete part-lead-solder-PWB system, accounting for strain-rate dependence of creep on applied stress and temperature, and the role of the part-lead dimensions and flexibility that determine the total creep deflection (solder strain range) during stress relaxation. The computer program has been used to explore the effects of various solder creep-fatigue parameters such as lead height and stiffness, thermal-cycle test profile, and part/board differential thermal expansion properties. One of the most interesting findings is the strong presence of unidirectional creep-ratcheting that occurs during thermal cycling due to temperature dominated strain-rate effects. To corroborate the solder fatigue model predictions, a number of carefully controlled thermal-cycle tests have been conducted using special bimetallic test boards.

A Direct Method on the Evaluation of Cyclic Steady State of Structures With Creep Effect

2014 ◽  
Vol 136 (6) ◽  
Author(s):  
Haofeng Chen ◽  
Weihang Chen ◽  
James Ure
Keyword(s):  
Fatigue Damage ◽  
Mechanical Load ◽  
Direct Method ◽  
Load Condition ◽  
Hysteresis Loops ◽  
Strain Range ◽  
Cyclic Behavior ◽  
Direct Evaluation ◽  
Plastic Strain Range ◽  
Creep Fatigue

This paper describes a new extension of the linear matching method (LMM) for the direct evaluation of cyclic behavior with creep effects of structures subjected to a general load condition in the steady cyclic state, with the new implementation of the cyclic hardening model and time hardening creep constitutive model. A benchmark example of a Bree cylinder and a more complicated three-dimensional (3D) plate with a center hole subjected to cyclic thermal load and constant mechanical load are analyzed to verify the applicability of the new LMM to deal with the creep fatigue damage. For both examples, the stabilized cyclic responses for different loading conditions and dwell time periods are obtained and validated. The effects of creep behavior on the cyclic responses are investigated. The new LMM procedure provides a general purpose technique, which is able to generate both the closed and nonclosed hysteresis loops depending upon the applied load condition, providing details of creep strain and plastic strain range for creep and fatigue damage assessments with creep fatigue interaction.

FEA Based Reliability Predictions for PBGA Packages Subjected to Isothermal Aging Prior to Thermal Cycling

2015 ◽  
Author(s):  
Munshi Basit ◽  
Mohammad Motalab ◽  
Jeffrey C. Suhling ◽  
John L. Evans ◽  
Pradeep Lall
Keyword(s):  
Finite Element ◽  
Solder Joint ◽  
Thermal Cycling ◽  
Isothermal Aging ◽  
Material Behavior ◽  
Lead Free ◽  
Stress Strain ◽  
Solder Material ◽  
Free Solder ◽  
Temperature Aging

The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In our prior work on aging effects, we have demonstrated that the observed material behavior degradations of Sn-Ag-Cu (SAC) lead free solders during room temperature aging (25 C) and elevated temperature aging (50, 75, 100, 125, and 150 C) were unexpectedly large. The measured stress-strain data demonstrated large reductions in stiffness, yield stress, ultimate strength, and strain to failure (up to 50%) during the first 6 months after reflow solidification. In this study, we have used both accelerated life testing and finite element modeling to explore how prior isothermal aging affects the overall reliability of PBGA packages subjected to thermal cycling. In the experimental work, an extensive test matrix of thermal cycling reliability testing has been performed using a test vehicle incorporating several sizes (5, 10, 15, 19 mm) of BGA daisy chain components with 0.4 and 0.8 mm solder joint pitches (SAC305). PCB test boards with 3 different surface finishes (ImAg, ENIG and ENEPIG) were utilized. In this paper, we concentrate on the reporting the results for a PBGA component with 15 mm body size. Before thermal cycling began, the assembled test boards were divided up into test groups that were subjected to several sets of aging conditions (preconditioning) including 0, 6, and 12 months aging at T = 125 °C. After aging, the assemblies were subjected to thermal cycling (−40 to +125 °C) until failure occurred. The Weibull data failure plots have demonstrated that the thermal cycling reliabilities of pre-aged assemblies were significantly less than those of non-aged assemblies. A three-dimensional finite element model of the tested 15 mm PBGA packages was also developed. The cross-sectional details of the solder ball and the internal structure of the BGA were examined by scanning electron microscopy (SEM) to capture the real geometry of the package. Simulations of thermal cycling from −40 to 125 C were performed. To include the effects of aging in the calculations, we have used a revised set of Anand viscoplastic stress-strain relations for the SAC305 Pb-free solder material that includes material parameters that evolve with the thermal history of the solder material. The accumulated plastic work (energy density dissipation) was used is the failure variable; and the Darveaux approach to predict crack initiation and crack growth was applied with aging dependent parameters to estimate the fatigue lives of the studied packages. We have obtained good correlation between our new reliability modeling procedure that includes aging and the measured solder joint reliability data. As expected from our prior studies on degradation of SAC material properties with aging, the reliability reductions were more severe for higher aging temperature and longer aging times.

An Evaluation of Creep-Fatigue Damage for the Prototype Process Heat Exchanger of the NHDD Plant

2011 ◽  
Vol 133 (5) ◽  
Author(s):  
Hyeong-Yeon Lee ◽  
Kee-Nam Song ◽  
Yong-Wan Kim ◽  
Sung-Deok Hong ◽  
Hong-Yune Park
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
High Temperature ◽  
Fatigue Damage ◽  
Inlet Temperature ◽  
Alloy 617 ◽  
Element Analysis ◽  
Creep Fatigue ◽  
Process Heat ◽  
Very High

A process heat exchanger (PHE) transfers the heat generated from a nuclear reactor to a sulfur-iodine hydrogen production system in the Nuclear Hydrogen Development and Demonstration, and was subjected to very high temperature up to 950°C. An evaluation of creep-fatigue damage, for a prototype PHE, has been carried out from finite element analysis with the full three dimensional model of the PHE. The inlet temperature in the primary side of the PHE was 950°C with an internal pressure of 7 MPa, while the inlet temperature in the secondary side of the PHE is 500°C with internal pressure of 4 MPa. The candidate materials of the PHE were Alloy 617 and Hastelloy X. In this study, only the Alloy 617 was considered because the high temperature design code is available only for Alloy 617. Using the full 3D finite element analysis on the PHE model, creep-fatigue damage evaluation at very high temperature was carried out, according to the ASME Draft Code Case for Alloy 617, and technical issues in the Draft Code Case were raised.

A Basic Study on Creep-Fatigue Damages Interaction for Sn-3.0Ag-0.5Cu as Lead Free Solder Material

2015 ◽  
Author(s):  
Hirokazu Oriyama ◽  
Takashi Kawakami ◽  
Takahiro Kinoshita
Keyword(s):  
Solder Joint ◽  
Fatigue Damage ◽  
Solder Joints ◽  
Mechanical Design ◽  
Low Cycle Fatigue ◽  
Creep Damage ◽  
Lead Free ◽  
Lead Free Solder ◽  
Creep Fatigue ◽  
Free Solder

Sn-Ag-Cu solder materials have been widely used for the mount process of electronics devices or semiconductor packages on print circuit board (PCB). The solder joints are sometimes opened under thermal cyclic loads as low cycle fatigue phenomenon. The fatigue life of solder joint has been investigated by many researchers with experimental and numerical methods. Generally, the induced thermal stress in solder joints should be relaxed as soon and creep damage is considered to be ignored in order to estimate lives of joints. However, it is probable that long term stress is applied to solder joints by the elastic follow-up phenomenon which are depending on the stiffness ratio between solder joints and the electronics device, because the elastic strain in PCB or the electronics device shifts to creep strain in solder joints gradually during a long time. Then the creep damage of solder joint should be counted for the mechanical design of mounted PCBs. And it is known that the interaction between creep damage and fatigue damage significantly shorten the life. In this study, it was discussed whether the interaction between fatigue damage and creep damage has to be considered or not for the mechanical design of the lead free solder joint with basic creep-fatigue tests at an elevated temperature.

Stress and strain range predictions for axisymmetric and two-dimensional components with stress concentrations and comparisons with notch stress-strain conversion rule estimates

1993 ◽  
Vol 28 (3) ◽  
pp. 209-221 ◽  
Author(s):  
S J Hardy ◽  
A R Gowhari-Anaraki
Keyword(s):  
Finite Element ◽  
Strain Range ◽  
Load Level ◽  
Analytical Relationship ◽  
Stress And Strain ◽  
Two Dimensional ◽  
Stress Concentrations ◽  
Stress Strain ◽  
Notch Stress ◽  
Axisymmetric Problems

A comparison is made between finite element predictions of strain and strain range for hollow tubes with axially loaded axisymmetric internal projections and values obtained from the simple notch stress-strain conversin (NSSC) rules. Data from other published analyses, where notch strains were predicted, support this investigation. The comparison is made for a variety of monotonic and cyclic loads, material hardenning assumptions, and geometries. An intermediate rule ( m = 0.5) which appears to correlate with the finite element predictions to a reasonable degree of accuracy, is identified. In addition, an analytical relationship is suggested for calculating strain and strain range, in terms of load level, strain hardening assumption, and elastic stress concentration factor (SCF) for this type of axisymmetric component. Also, a comparison is made between some previously published experimental and numerical data, obtained for other two-dimensional and axisymmetric problems, and NSSC rule estimates in order to confirm the suitability of the intermediate rule. Finally, on the basis of these comparisons, an approximate procedure for predicting stress and strain ranges under conditions of gross yielding is presented for plane stress, plane strain, and axisymmetric problems.

Sign in / Sign up

Export Citation Format

Share Document