End Reactions and Stresses in Three-Dimensional Pipe Lines

1937 ◽  
Vol 4 (2) ◽  
pp. A68-A74
Author(s):  
G. B. Karelitz ◽  
J. H. Marchant
Keyword(s):  
Thermal Expansion ◽  
Numerical Computation ◽  
Three Dimensional ◽  
Pipe Line ◽  
Steam Main ◽  
Pipe Lines

Abstract The authors present a method for the numerical computation of the end forces and couples in a three-dimensional pipe line. The method takes care of a pipe line with any number of straight parts connected by bends. A procedure of computation is also shown when parts of the pipe line are skewed. The ends of the line may be partially or completely constrained against rotation and translation. A construction for the analysis of stresses in the pipe bends is given. The method is illustrated by a sample computation of the end forces and couples in a steam main which is restrained against thermal expansion.

Tentative Recommended Specifications for Asphalt-Type Protective Coatings For Underground Pipe Lines (Minimum Recommended Protection)—A Report of NACE Technical Unit Committee T-2H On Asphalt Type Pipe Coatings

CORROSION ◽  
1958 ◽  
Vol 14 (8) ◽  
pp. 37-38
Keyword(s):  
Protective Coatings ◽  
Physical Characteristics ◽  
Coating System ◽  
Testing Methods ◽  
Underground Pipe ◽  
Pipe Line ◽  
Pipe Lines

Abstract Recommended minimum characteristics of an asphalt wrapped underground pipe line coating system are given. Included are physical characteristics of primer, enamel and wrapping, testing methods for primer and enamel. 6.4.5

In-Line-Inspection (ILI) of a Pipeline in Constrained Condition and Establishing Integrity of the Pipeline

2021 ◽  
Author(s):  
Partha Bose
Keyword(s):  
Thermal Expansion ◽  
Natural Gas ◽  
Gas Pipeline ◽  
Bridge Structure ◽  
Site Specific ◽  
Integrity Assessment ◽  
Natural Gas Pipeline ◽  
Pipe Line ◽  
Specific Assessment ◽  
Mumbai City

Abstract One 24” Diameter and around 40 km length Natural Gas pipeline caters as energy life line for Mumbai city; supplying app 4.5 MMSCMD Gas for Auto Sectors (CNG), House Hold (PNG), Power, Fertiliser, Petrochemical Sectors. Though line is equipped with Launcher & Receiver; but onward became challenging one for executing pigging for many constraints: - Presence of One SR bend - Presence of 1.5 D bends - Presence of 1.5 D bends with Back to Back configuration - Three (3) no Thermal Expansion Loops, in 2 Km stretch passing as above ground pipeline through bridge (above Creek) section The pipe line is passing through High Consequence areas, including its interim stretch of 2km passing as above ground section through bridge structure. Intelligent pigging is an obvious first preference for online precise integrity assessment for any pipeline. Site Specific Assessment, Detail Engineering & Committed approach resulted in Feasibility & Development of ILI Tool, Practical Testing in fore hand before actual pigging & onward Integrity Assessment of the pipeline conducted by accomplishing Successful ILI run.

Role of Out-of-Plane Coefficient of Thermal Expansion in Electronic Packaging Modeling

1999 ◽  
Vol 122 (2) ◽  
pp. 121-127 ◽  
Author(s):  
Manjula N. Variyam ◽  
Weidong Xie ◽  
Suresh K. Sitaraman
Keyword(s):  
Thermal Expansion ◽  
Electronic Packaging ◽  
Thermal Loading ◽  
Coefficient Of Thermal Expansion ◽  
Plane Deformation ◽  
Three Dimensional ◽  
Dissimilar Materials ◽  
3D Models ◽  
Material Behavior ◽  
Element Analysis

Components in electronic packaging structures are of different dimensions and are made of dissimilar materials that typically have time, temperature, and direction-dependent thermo-mechanical properties. Due to the complexity in geometry, material behavior, and thermal loading patterns, finite-element analysis (FEA) is often used to study the thermo-mechanical behavior of electronic packaging structures. For computational reasons, researchers often use two-dimensional (2D) models instead of three-dimensional (3D) models. Although 2D models are computationally efficient, they could provide misleading results, particularly under thermal loading. The focus of this paper is to compare the results from various 2D, 3D, and generalized plane-deformation strip models and recommend a suitable modeling procedure. Particular emphasis is placed to understand how the third-direction coefficient of thermal expansion (CTE) influences the warpage and the stress results predicted by 2D models under thermal loading. It is seen that the generalized plane-deformation strip models are the best compromise between the 2D and 3D models. Suitable analytical formulations have also been developed to corroborate the findings from the study. [S1043-7398(00)01402-X]

Three-dimensional hierarchical metamaterials incorporating multi-directional programmable thermal expansion

2021 ◽  
pp. 104095
Author(s):  
Kaiyu Wang ◽  
Fan Lin ◽  
Jiaxin Chen ◽  
Zhuoyi Wei ◽  
Kai Wei ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Three Dimensional

Investigation of Thermal Influence on the Assembly of Polymer Electrolyte Membrane Fuel Cell Stacks

2012 ◽  
Vol 512-515 ◽  
pp. 1509-1514
Author(s):  
Lin Fa Peng ◽  
Dian Kai Qiu ◽  
Pei Yun Yi ◽  
Xin Min Lai
Keyword(s):  
Thermal Expansion ◽  
Fuel Cell ◽  
Contact Pressure ◽  
Proton Exchange Membrane ◽  
Three Dimensional ◽  
Gas Diffusion ◽  
Proton Exchange ◽  
Membrane Electrode ◽  
Fe Model ◽  
Assembly Process

The assembly force in a proton exchange membrane fuel cell (PEMFC) stack affects the characteristics of the porosity and electrical conductivity. Generally, the stack is assembled at room temperature while it’s operated at about 80 °Cor even higher. As a result, the assembly pressure can’t keep constant due to thermal expansion. This paper focuses on the contact pressure between membrane electrode assembly (MEA) and bipolar plates in real operations. A three-dimensional finite element (FE) model for the assembly process is established with coupled thermal-mechanical effects. The discipline of contact pressure under thermal-mechanical effect is investigated. A single cell stack is fabricated in house for the analysis of contact pressures on gas diffusion layer at different temperatures. The results show that as the temperature increases, contact pressure increases due to thermal expansion. It indicates that the influence of thermal expansion due to temperature variation should be taken into consideration for the design of the stack assembly process.

Sign in / Sign up

Export Citation Format

Share Document