Experimental Investigation of Heat Transfer Dependency on Conjugate and Convective Thermal Boundary Conditions in Pin Fin Channel

2015 ◽  
Author(s):  
Weihong Li ◽  
Zhongran Chi ◽  
Rui Kan ◽  
Jing Ren ◽  
Hongde Jiang
Keyword(s):  
Heat Transfer ◽  
Liquid Crystal ◽  
Boundary Conditions ◽  
Internal Wall ◽  
External Temperature ◽  
External Wall ◽  
Pin Fin ◽  
Thermal Boundary Conditions ◽  
Temperature Distributions ◽  
Pin Fin Arrays

The present work experimentally quantifies the effects of thermal boundary conditions, i.e., conjugate and convective boundary conditions, on heat transfer performance for the pin fin channel in trailing edge of gas turbine blade. The geometry of pin fin arrays is typical of x/D=y/D=2.5 and H/D=1. For conjugate case, model is constructed with a relatively high conductivity material so that the Biot number of the model matches engine condition. Uniform heat flux is imposed along the external wall of pin fin arrays and highly resolved temperature distributions of internal wall is obtained with steady liquid crystal, meanwhile external temperature is measured through thermocouples. For convective case, model is constructed with low thermal conductivity material to ensure the usage of transient liquid crystal to obtain heat transfer coefficients of the internal wall on the same configuration. Both the measurements are used as boundary conditions to conduct simulation of solid part of pin fin array. Internal and external wall non-dimensional temperature distributions, as well as isothermal lines distribution, of the two cases are compared, results indicate that it will produce large errors in temperature predictions without considering conjugate effect. Further analysis are made about the mechanism of thermal boundary conditions in determining wall temperature, which demonstrates the necessity of taking conjugate heat transfer effect in turbine cooling design.

Heat Transfer Contributions of Pins and Endwall in Pin-Fin Arrays: Effects of Thermal Boundary Condition Modeling

1999 ◽  
Vol 121 (2) ◽  
pp. 257-263 ◽  
Author(s):  
M. K. Chyu ◽  
Y. C. Hsing ◽  
T. I.-P. Shih ◽  
V. Natarajan
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Boundary Conditions ◽  
Transfer Coefficient ◽  
Transfer Coefficients ◽  
Pin Fin ◽  
Heat Transfer Coefficients ◽  
Thermal Boundary Conditions ◽  
The Individual ◽  
Pin Fin Arrays

Short pin-fin arrays are often used for cooling turbine airfoils, particularly near the trailing edge. An accurate heat transfer estimation from a pin-fin array should account for the total heat transfer over the entire wetted surface, which includes the pin surfaces and uncovered endwalls. One design question frequently raised is the actual magnitudes of heat transfer coefficients on both pins and endwalls. Results from earlier studies have led to different and often contradicting conclusions. This variation, in part, is caused by imperfect or unrealistic thermal boundary conditions prescribed in the individual test models. Either pins or endwalls, but generally not both, were heated in those previous studies. Using a mass transfer analogy based on the naphthalene sublimation technique, the present experiment is capable of revealing the individual heat transfer contributions from pins and endwalls with the entire wetted surface thermally active. The particular pin-fin geometry investigated, S/D = X/D = 2.5 and H/D = 1.0, is considered to be one of the optimal array arrangement for turbine airfoil cooling. Both inline and staggered arrays with the identical geometric parameters are studied for 5000 ≤ Re ≤ 25,000. The present results reveal that the general trends of the row-resolved heat transfer coefficients on either pins or endwalls are somewhat insensitive to the nature of thermal boundary conditions prescribed on the test surface. However, the actual magnitudes of heat transfer coefficients can be substantially different, due to variations in the flow bulk temperature. The present study also concludes that the pins have consistently 10 to 20 percent higher heat transfer coefficient than the endwalls. However, such a difference in heat transfer coefficient imposes very insignificant influence on the overall array-averaged heat transfer, since the wetted area of the uncovered endwalls is nearly four times greater than that of the pins.

scholarly journals Heat Transfer Contributions of Pins and Endwall in Pin-Fin Arrays: Effects of Thermal Boundary Condition Modeling

1998 ◽  
Author(s):  
M. K. Chyu ◽  
Y. C. Hsing ◽  
T. I.-P. Shih ◽  
V. Natarajan
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Boundary Conditions ◽  
Transfer Coefficient ◽  
Transfer Coefficients ◽  
Pin Fin ◽  
Heat Transfer Coefficients ◽  
Thermal Boundary Conditions ◽  
The Individual ◽  
Pin Fin Arrays

Short pin-fin arrays are often used for cooling turbine airfoils, particularly near the trailing edge. An accurate heat transfer estimation from a pin-fin array should account for the total heat transfer over the entire wetted surface which includes the pin surfaces and uncovered end walls. One design question frequently raised is the actual magnitudes of heat transfer coefficients on both pins and endwalls. Results from earlier studies have led to different and often contradicting conclusions. This variation, in part, is caused by imperfect or unrealistic thermal boundary conditions prescribed in the individual test models. Either pins or endwalls, but generally not both, were heated in those previous studies. Using a mass transfer analogy based on the naphthalene sublimation technique, the present experiment is capable of revealing the individual heat transfer contributions from pins and endwalls with the entire wetted surface thermally active. The particular pin-fin geometry investigated, S/D = X/D = 2.5 and H/D = 1.0, is considered to be one of the optimal array arrangement for turbine airfoil cooling. Both inline and staggered arrays with the identical geometric parameters are studied for 5,000 ≤ Re ≤ 25,000. The present results reveal that the general trends of the row-resolved heat transfer coefficients on either pins or endwalls are somewhat insensitive to the nature of thermal boundary conditions prescribed on the test surface. However, the actual magnitudes of heat transfer coefficients can be substantially different, due to variations in the flow bulk temperature. The present study also concludes that the pins have consistently 10 to 20% higher heat transfer coefficient than the endwalls. However, such a difference in heat transfer coefficient imposes very insignificant influence on the overall array-averaged heat transfer, since the wetted area of the uncovered endwalls is nearly four times greater than that of the pins.

Flow and Heat Transfer in Ducts of Arbitrary Shape With Arbitrary Thermal Boundary Conditions

1966 ◽  
Vol 88 (4) ◽  
pp. 351-357 ◽  
Author(s):  
E. M. Sparrow ◽  
A. Haji-Sheikh
Keyword(s):  
Heat Transfer ◽  
Boundary Conditions ◽  
Cross Section ◽  
Arbitrary Cross Section ◽  
Space Technology ◽  
Closed Form Solutions ◽  
Thermal Boundary Conditions ◽  
Flow And Heat Transfer ◽  
Temperature Distributions ◽  
Circular Segment

A computation-oriented method of analysis is presented for determining closed-form solutions for fully developed laminar flow and heat transfer in ducts of arbitrary cross section. The analytical method can accommodate both uniform and circumferentially varying thermal boundary conditions. The solutions provide information for local quantities such as the velocity and the temperature distributions as well as for overall quantities such as the friction factor and the Nusselt number. As an application of the method, solutions are presented for flow and for heat transfer in ducts of circular-segment cross section, a configuration that is of current interest in space technology.

Steady Thermochromic Liquid Crystal Technique for Study of Conjugate Heat Transfer Problems

2003 ◽  
Author(s):  
C. J. Douglass ◽  
J. S. Kapat ◽  
E. Divo ◽  
A. J. Kassab ◽  
J. Tapley ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Liquid Crystal ◽  
Boundary Conditions ◽  
Surface Heat Flux ◽  
Conjugate Heat Transfer ◽  
Surface Heat ◽  
Test Block ◽  
Thermochromic Liquid Crystal ◽  
Thermal Boundary Conditions

This paper presents a steady measurement technique based on thermochromic liquid crystals (TLC) that can be used for study of conjugate heat transfer. In contrast to the more commonly used transient thermochromic liquid crystal technique, this technique requires steady-state experiments, and eliminates some of the limitations of the transient version at the cost of measurements or knowledge of thermal conditions all surfaces and increased computations for data reduction. This technique requires that thermal boundary conditions be known or measured on all internal or external surfaces of the test block. All surfaces that are exposed to external air flow are coated with a broad-bandwidth TLC. The thermal boundary conditions are then sent to a steady conduction solver that involves the boundary element method (BEM) and an inverse problem approach (BEM/IP). This combined BEM/IP approach minimizes the effects of random experimental error in measured data and calculates surface heat flux, from which the intended convective heat flux coefficients can then be calculated. The technique is applied to a prismatic stainless steel block exposed to warm air flows on three sides — an arrangement that has been used often to simulate flow through a blade tip gap. It is found that an in-situ pixel-by-pixel calibration of TLC hue vs temperature is needed in order to obtain reasonable accuracy. A calibration-curve-fit uncertainty of better than 0.4°C (at 95% confidence level) was obtained in this process. In the actual experiments, conjugate heat transfer was set up by passing cold water through three cooling channels that span the test block. Once the experiments are completed and the TLC colors are converted to surface temperature distributions, the BEM/IP approach is used to obtain surface heat flux distributions, and then distribution of heat transfer coefficients.

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