Effect of Thin Metal Film and Micro Structure of Surface on Condensation Pattern

Author(s):  
Tomohito Nishimura ◽  
Yuki Mikoshiba ◽  
Hiroyasu Ohtake ◽  
Koji Hasegawa

The water condensation is important for wide range of industrial systems such as condensers and heat exchangers of steam power plants and refrigerators. The condensation generally has two patterns; filmwise condensation (FWC) and drop-wise condensation (DWC). DWC has one-tenth higher heat transfer coefficient than that of FWC. It has been pointed out by many investigators that DWC occurs on the hydrophobic surface and FWC occurs on hydrophilic surface. However, the durability of those hydrophobic effects was not clear enough. In order to maintain a sufficiently long DWC, it is important to understand the effect of the surface property and structure on the condensation surface in more detail. The recent advancement of MEMS (Micro Electro Mechanical System) technology enables us to change the physical nature the surface in the micro scale. It is expected that the hydrophobic surface by the MEMS technology may kept DWC for a longer time. In the present paper, we experimentally investigate the effects of thin metal film and micro structured surface on condensation pattern. Especially, our condensation experiments were performed with the micro structured surfaces by using etching and the metal thin film surfaces by sputtering for approximately 24 hours. Silicon (Si) wafer was used as a basic surface. For the metal thin films surface, we used sputtered Lead (Pb) and Titanium (Ti) on Si surface. For the micro structured surfaces, micro-structured grid was etched on Si surface with several conditions. In order to obtain the relation between the condensation pattern and surface condition, the surface conditions were measured by laser micro-scope, contact angle meter and atomic force microscope (AFM). For the metal thin films surface, condensation patterns on thin Pb film surface showed DWC. Meanwhile, condensation patterns on thin Ti surfaces showed FWC. From our results, the adsorption forces decreased with increasing contact angle on DWC for Pb. On the other hand, the adsorption forces increased with decreasing contact angle on FWC for Ti. For the micro structured surfaces, condensation pattern was FWC and contact angle decreased in our experimental results. This is because that the condensed water is accumulated in the groove on the micro structure surface.

2017 ◽  
Vol 2017.23 (0) ◽  
pp. 503
Author(s):  
Tomohito NISHIMURA ◽  
Yuki MIKOSHIBA ◽  
Hiroyasu OHTAKE ◽  
Koji HASEGAWA

Author(s):  
Kohei Yamazaki ◽  
Hiroyasu Ohtake ◽  
Koji Hasegawa

The present study was intended to examine how the condensation heat transfer, especially the dropwise condensation, was affected by modifying the surface nature. In the present study, condensation heat transfer experiments for steam were performed by using mirror-finished copper surface and some very thin metal-film surfaces by using sputtering on mirror-finished copper block. That is, the effects on pattern of condensation heat transfer, i.e., dropwise or film-wise condensation, of metal-sputtered surfaces were examined experimentally and qualitatively. The present experimental results showed that the condensation on sputtered metal surfaces of Copper (Cu), Chromium (Cr) and Lead (Pb), became dropwise condensation. The heat transfer coefficients were ten times higher than the Nusselt equation. The condensation on sputtered metal surface of Titanium (Ti) became filmwise condensation. High contact angle was trended to be dropwise condensation on very thin metal-film surfaces by using sputtering.


2012 ◽  
Vol 116 (22) ◽  
pp. 12149-12155 ◽  
Author(s):  
Shirly Borukhin ◽  
Cecile Saguy ◽  
Maria Koifman ◽  
Boaz Pokroy

1999 ◽  
Author(s):  
Seok Chung ◽  
Jun Keun Chang ◽  
Dong Chul Han

Abstract To make some MF.MS devices such as sensors and actuators be useful in the medical application, it is required to integrate this devices with power or sensor lines and to keep the hole devices biocompatible. Integrating micro machined sensors and actuators with conventional copper lines is incompatible because the thin copper lines are not easy to handle in the mass production. To achieve the compatibility of wiring method between MEMS devices, we developed the thin metal film deposition process that coats micropattered thin copper films on the non silicon-wafer substrate. The process was developed with the custom-made three-dimensional thin film sputter/evaporation system. The system consists of process chamber, two branch chambers, substrate holder unit and linear/rotary motion feedthrough. Thin metal film was deposited on the biocompatible polymer, polyurethane (PellethaneR) and silicone, catheter that is 2 mm in diameter and 1,000 mm in length. We deposited Cr/Cu and Ti/Cu layer and made a comparative study of the deposition processes, sputtering and evaporation. The temperature of both the processes were maintained below 100°C, for the catheter not melting during the processes. To use the films as signal lines connect the signal source to the actuator on the catheter tip, we machined the films into desired patterns with the eximer laser. In this paper, we developed the thin metal film deposition system and processes for the biopolymeric substrate used in the medical MEMS devices.


2013 ◽  
Vol 536 ◽  
pp. 142-146 ◽  
Author(s):  
C. Camerlingo ◽  
M.P. Lisitskiy ◽  
L. De Stefano ◽  
I. Rea ◽  
I. Delfino ◽  
...  

2006 ◽  
Vol 29 (2) ◽  
pp. 371-378 ◽  
Author(s):  
G. Norberg ◽  
S. Dejanovic ◽  
H. Hesselbom

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