Thermal Reliability Design and Optimization for Multilayer Composite Electronic Boards

2005 ◽  
Author(s):  
Amir Khalilollahi ◽  
Russell L. Warley ◽  
Oladipo Onipede
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Stress Intensity ◽  
Finite Element Model ◽  
Element Model ◽  
Fe Model ◽  
Transfer Coefficients ◽  
Thermal Reliability ◽  
Irreversible Damage ◽  
Heat Transfer Coefficients

Boards made of composites are susceptible of structural failure or irreversible damage under thermally raised stresses. A thermal/structural finite element model is integrated in this study to enable the predictions of the temperature and stress distribution of vertically clamped parallel circuit boards that include series of symmetrically mounted heated electronic modules (chips). The board is modeled as a thin plate containing four heated flush rectangular areas that represent the electronic modules. The finite element model should be to able to accept the convection heat transfer on the board surface, heat generation in the modules, and directional conduction inside the board. A detailed 3-D CFD model is incorporated to predict the conjugate heat transfer coefficients that strongly affect the temperature distribution in the board and modules. Structural analyses are performed by a FE model that uses the heat transfer coefficients mentioned above, and structural elements capable of handling orthotropic material properties. The stress fields are obtained and studied for the models possessing two and there laminates with different fiber orientations, and inter-fiber angles. Appreciable differences in values of max stress intensity were observed as the fiber orientation and inter-fiber angle changed. The angular parameters in this study were guided by experimental design (DOE) concepts leading to a metamodel of the stress intensity in the board. The optimum design variables found by the equations of the metamodel.

Thermal Stress Reduction and Optimization for Orthotropic Composite Boards

2005 ◽  
Author(s):  
Amir Khalilollahi ◽  
Russell L. Warley
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Finite Element Model ◽  
Volume Fraction ◽  
Element Model ◽  
Fe Model ◽  
Transfer Coefficients ◽  
Fiber Volume ◽  
Irreversible Damage ◽  
Heat Transfer Coefficients

Composite printed electronic boards are susceptible of structural failure or irreversible damage under thermally raised stresses. A thermal/structural finite element model is integrated in this study to enable the predictions of the temperature and stress distribution of vertically clamped parallel circuit boards that include series of symmetrically mounted heated electronic modules (chips). The board is modeled as a thin plate containing four heated flush rectangular areas that represent the electronic modules. The finite element model should be to able to accept the convection heat transfer on the board surface, heat generation in the modules, and directional conduction inside the board. A detailed 3-D CFD model is incorporated to predict the conjugate heat transfer coefficients that strongly affect the temperature distribution in the board and modules. Structural analyses are performed by a FE model that uses the heat transfer coefficients mentioned above, and structural elements capable of handling orthotropic material properties. The stress fields are obtained and compared for the models possessing different fiber orientations and fiber volume fractions. Appreciable differences in stress and thermal gradient fields were observed. The values of fiber volume fraction and fiber orientation at which to conduct analyses was guided by experimental design (DOE) ideas leading to a metamodel of the stress intensity and temperature gradient in the board which was used to represent the complied results of this study.

Finite Element Model of Human Cochlea Considering of the Helicotrema Size

2013 ◽  
Vol 456 ◽  
pp. 576-581 ◽  
Author(s):  
Li Fu Xu ◽  
Na Ta ◽  
Zhu Shi Rao ◽  
Jia Bin Tian
Keyword(s):  
Finite Element ◽  
Finite Element Model ◽  
Basilar Membrane ◽  
Round Window ◽  
Element Model ◽  
Oval Window ◽  
Fe Model ◽  
Cochlear Duct ◽  
Human Cochlea ◽  
Set Up

A 2-D finite element model of human cochlea is established in this paper. This model includes the structure of oval window, round window, basilar membrane and cochlear duct which is filled with fluid. The basilar membrane responses are calculated with sound input on the oval window membrane. In order to study the effects of helicotrema on basilar membrane response, three different helicotrema dimensions are set up in the FE model. A two-way fluid-structure interaction numerical method is used to compute the responses in the cochlea. The influence of the helicotrema is acquired and the frequency selectivity of the basilar membrane motion along the cochlear duct is predicted. These results agree with the experiments and indicate much better results are obtained with appropriate helicotrema size.

Experimental Platforms and Finite Element Analysis on Hot Stamping Processes

2014 ◽  
Vol 1063 ◽  
pp. 334-338 ◽  
Author(s):  
Tzu Hao Hung ◽  
Heng Kuang Tsai ◽  
Fuh Kuo Chen ◽  
Ping Kun Lee
Keyword(s):  
Heat Transfer ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Process Design ◽  
Hot Stamping ◽  
Boron Steel ◽  
Transfer Coefficients ◽  
Element Analysis ◽  
Heat Transfer Coefficients ◽  
The Finite Element Analysis

Due to the complexity of hot stamping mechanism, including the coupling of material formability, thermal interaction and metallurgical microstructure, it makes the process design more difficult even with the aid of the finite element analysis. In the present study, the experimental platforms were developed to measure and derive the friction and heat transfer coefficients, respectively. The experiments at various elevated temperatures and contact pressures were conducted and the friction coefficients and heat transfer coefficients were obtained. A finite element model was also established with the experimental data and the material properties of the boron steel calculated from the JMatPro software. The finite element simulations for the hot stamping forming of an automotive door beam, including transportation analysis, hot forming analysis and die quenching analysis were then performed to examine the forming properties of the door beam. The validation of the finite element results by the production part confirms the efficiency and accuracy of the developed experimental platforms and the finite element analysis for the process design of hot stamping.

Automotive Glass Exciter Technology for Acoustic Application

2014 ◽  
Author(s):  
Babak Ebrahimi ◽  
Amir Khajepour ◽  
Todd Deaville
Keyword(s):  
Finite Element ◽  
Finite Element Model ◽  
Experimental Studies ◽  
Element Model ◽  
Fe Model ◽  
Component Level ◽  
Modeling And Analysis ◽  
Electric Actuator ◽  
Conventional Systems ◽  
Fine Tune

This paper discusses the modeling and analysis of a novel audio subwoofer system for automotive applications using the automobile windshield glass. The use of a piezo-electric actuator coupled with a mechanical amplifier linked to a large glass panel provides a highly efficient method of producing sound. The proposed subwoofer system has the advantage over existing conventional systems of not only reducing the weight of the automobile, but also a significant power savings resulting in an increase of expected fuel economy. Among various design challenges, the glass-sealing design is of huge importance, as it affects the system dynamic response and so the output sound characteristics. The main goal in this manuscript is to evaluate different glass-sealing design configurations by providing a comprehensive Finite Element model of the system. To do so, a comprehensive, yet simplified FE model is developed, and experimental studies are performed in the component level to fine-tune and verify the model. Harmonic response of the system for each sealing configuration design is obtained in the frequency range of 0–200 Hz, and the results are compared and discussed. The finite element model is also beneficial in preliminary design of other components as well as the exciter placement, and predicting the performance of the overall system.

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