Finite Element Simulation of Piezoelectric Wafer Active Sensors Based Structural Health Monitoring

Author(s):  
Weiping Liu ◽  
Victor Giurgiutiu

Crack detection with piezoelectric wafer active sensors (PWAS) is emerging as an effective and powerful technique in structural health monitoring (SHM). Modeling and simulation of PWAS and host structure play an important role in the SHM applications with PWAS. For decades finite element method has been extensively applied in the analysis of piezoelectric materials and structures. The advantage of finite element analysis over analytical solutions is that stress and electrical field measurements of complex geometries, and their variations throughout the device, are more readily calculated. FEM allows calculation of the stress and electric field distributions under static loads and under any applied electrical frequency, and so the effect of device geometry can be assessed and optimized without the need to manufacture and test numerous devices. Coupled field analysis taking both mechanical motions and electrical characteristics into account should all be employed to provide a systemic overview of the piezoelectric sensors/actuators (even arrays of them) and the host structures. This use of PWAS for SHM has followed two main paths: (a). Wave propagation (b). Electromechanical impedance; Previous research has shown that PWAS can detect damage using wave reflections, changes in wave signature, or changes in the electromechanical (E/M) impedance spectrum. The primary goal of this paper is to investigate the use of finite element method (FEM) to simulate various SHM methods with PWAS. For the simulation of Electro-mechanical (E/M) impedance technique, simple models, like free PWAS of different shapes and 1-dimmension beam with PWAS are investigated and the simulated structural E/M impedance was presented. For the wave propagation SHM technique, a long beam with several PWAS installed was studied. One PWAS is excited by tone burst signals and elastic wave will propagate along the beam. The existence of a crack will affect the structure integrity and the echo reflected by crack can be observed through the simulations. By using the coupled field elements, direct simulation of electro-mechanical interaction of the PWAS and the host structure was made possible. The electrical potential generated on the PWAS surface by the stimulation of elastic wave can be examined in our FEM analysis. The simulation results are then compared to analytical calculation and experimental data.

Author(s):  
Abraham Light-Marquez ◽  
Andrei Zagrai

This report discusses the development of an embeddable impact detection system utilizing an array of piezoelectric wafer active sensors (PWAS) and a microcontroller. Embeddable systems are a critical component to successfully implement a complete and robust structural health monitoring system. System capabilities include impact detection, impact location determination and digitization of the impact waveform. A custom algorithm was developed to locate the site of the impact.. The embedded system has the potential for additional capabilities including advanced signal processing and the integration of wireless functionality. For structural health monitoring applications it is essential to determine the extent of damage done to the structure. In an attempt to determine these parameters a series of impact tests were conducted using a ball drop tower on a square aluminum plate. The response of the plate to the impact event was recorded using a piezoelectric wafer sensor network attached to the surface of the plate. From this testing it was determined that several of the impact parameters are directly correlated with the features recorded by the sensor network.


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