On Modeling and Simulation of the Discharging Activity in Electrochemical Discharge Machining

2015 ◽  
Author(s):  
Baoyang Jiang ◽  
Shuhuai Lan ◽  
Jun Ni
Keyword(s):  
Process Modeling ◽  
Material Removal ◽  
Process Model ◽  
Energy Intensity ◽  
Good Accuracy ◽  
Material Removal Mechanism ◽  
Electrochemical Discharge Machining ◽  
Electrochemical Discharge ◽  
Releasing Process

Electrochemical discharge machining (ECDM) is a promising machining technology to process non-conducing and brittle materials, featuring high throughput and good accuracy in meso and micro scale machining of hard-to-machine materials. Currently ECDM has not yet attracted wide interest from the industry because of the low controllability and repeatability. There is a huge gap in process optimization to make ECDM viable in industry. A good process model is essential to achieve an improved and optimized process. The fundamental of ECDM is the discharging activity, which triggers various mechanisms to remove material. Therefore characterization of sparks from the aspects of electrical and thermal properties is the premise of process modeling. In this paper, experimental investigation and modeling of discharging activity was presented. The spark releasing process was studied in terms of discharge energy, intensity distribution, and material removal. Conic tool electrodes were fabricated to achieve more consistent discharging. The material removal mechanism was revealed by analytical derivation and simulated with numerical methods.

Development of a Combined Analytical and Empirical Model for Beveling of Quartz Crystal Wafers

2005 ◽  
Author(s):  
Chensong (Jonathan) Dong
Keyword(s):  
Process Optimization ◽  
Process Modeling ◽  
Material Removal ◽  
Process Model ◽  
Quartz Crystal ◽  
Profile Measurement ◽  
Removal Mechanism ◽  
Trial And Error ◽  
Material Removal Mechanism ◽  
Crystal Wafer

Beveling or contouring is an important step in the processing of quartz crystal wafers used in resonators. This paper presents a combined analytical and empirical approach for contouring process modeling. Based on the bevel profile measurement the material removal mechanism is analyzed and new characteristics describing the beveling process are introduced. A process model is developed to determine the process parameters of beveling. Compared to the traditional trial-and-error approach, this approach provides a powerful tool for developing beveling methods for new crystal wafer design and beveling process optimization.

Investigation on Electrochemical Discharge Micro-Machining of Silicon Carbide

2017 ◽  
Vol 4 (2) ◽  
pp. 29-44 ◽  
Author(s):  
B.R. Sarkar ◽  
B. Doloi ◽  
B. Bhattacharyya
Keyword(s):  
Silicon Carbide ◽  
Material Removal ◽  
Removal Rate ◽  
Machining Parameters ◽  
Micro Machining ◽  
Electrode Gap ◽  
Multi Objective ◽  
Electrochemical Discharge Machining ◽  
Electrochemical Discharge ◽  
Conducting Materials

Electrochemical discharge machining (ECDM) process has great potential to machine hard, brittle and electrically non-conducting materials in micron range. The objective of this paper is to investigate into electrochemical discharge micro-machining on electrically semi-conductor type silicon carbide (SiC) material so as to study the effects of applied voltage, electrolyte concentration and inter-electrode gap on material removal rate (MRR) and radial overcut (ROC) of micro-drilled hole. Experiments were conducted based on L9 array of Taguchi method with stainless steel µ-tool of 300µm diameter using NaOH electrolyte. An attempt has been made to find out the single as well as multi-objective optimal parametric combinations for maximum MRR and minimum ROC. The single-objective parametric combinations were selected as 45V/20wt%/20mm and 25V/20wt%/40mm for maximum MRR and minimum ROC respectively whereas multi-objective optimal parametric combinations was found as 25V/20wt%/40mm. Further mathematical models have been developed between the above machining parameters and characteristics.

Material Removal Mechanism of Chemo-Mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW)

2008 ◽  
Vol 389-390 ◽  
pp. 459-464 ◽  
Author(s):  
Dong Ming Guo ◽  
Y.B. Tian ◽  
Ren Ke Kang ◽  
Li Bo Zhou ◽  
M.K. Lei
Keyword(s):  
Electron Microscope ◽  
Cross Section ◽  
Material Removal ◽  
Process Model ◽  
Grinding Wheel ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Mechanical Grinding ◽  
Study Results ◽  
Si Wafer

An innovative fixed abrasive grinding process of chemo-mechanical grinding (CMG) by using soft abrasive grinding wheel (SAGW) has been recently proposed to achieve a damage-free ground workpiece surface. The basic principle, ideas and characteristics of CMG with SAGW are briefly introduced in this paper. The CMG experiments using newly developed SAGW for Si wafer are conducted at the condition of dry grinding. The grinding performances are evaluated and analyzed in terms of surface roughness, surface topography and surface/subsurface damage of ground wafer by use of Zygo interferometer, Scan Introduction ning Electron Microscope (SEM) and Cross-section Transmission Electron Microscope (Cross-section TEM). The component of product of ground Si surface is studied by X-ray Photoelectron Spectroscopy (XPS) to verify chemical reaction between the abrasive / additives of grinding wheel and Si wafer. The CMG process model by using SAGW is developed to understand the material removal mechanism and generation principle of damage-free surface. The study results show that the material removal mechanism of CMG by using SAGW can be explained as a hybrid process of chemical and mechanical action.

Experimental Investigation of Drilling Incorporated Electrochemical Discharge Machining

2014 ◽  
Author(s):  
Baoyang Jiang ◽  
Shuhuai Lan ◽  
Jun Ni
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Machining Process ◽  
Hole Drilling ◽  
Tool Electrode ◽  
Drilling Process ◽  
Electrochemical Discharge Machining ◽  
Electrochemical Discharge ◽  
Micro Drilling

Electrochemical discharge machining (ECDM) is a non-conventional micromachining technology, and is highlighted for non-conductive brittle materials. However, the outcomes of ECDM have many restrictions in application due to limitations on efficiency, accuracy, and machining quality. In this paper, a drilling incorporated ECDM process is presented and analyzed to enhance material removal rate in ECDM drilling process. Incorporating micro-drilling into ECDM significantly increases the rate of material removal, especially in deep hole drilling. As fundamentals of the machining process, material removal mechanisms have been investigated to account for the increment in material removal rate by incorporating micro-drilling. Vibration of tool electrode, induced by a piezo-actuator, was introduced to further enhance material removal rate. Quantitative studies were conducted to determine the appropriate process parameters of drilling incorporated ECDM with tool vibration.

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