scholarly journals Analytical Study of Thermal Heat Conduction inside Two Orthotropic Mediums in Cylindrical Geometry

2021 ◽  
Author(s):  
Mohammed Nikchi ◽  
Khalid Zniber ◽  
Hamid Hamza ◽  
Jawad Lahjomri ◽  
Abdelaziz Oubarra
Author(s):  
Anand Desai ◽  
James Geer ◽  
Bahgat Sammakia

This paper presents the results of an analytical study of steady state heat conduction in multiple rectangular domains. Any finite number of such domains may be considered in the current study. The thermal conductivity and thickness of these domains may be different. The entire geometry composed of these connected domains is considered as adiabatic on the lateral surfaces and can be subjected to uniform convective cooling at one end. The other end of the geometry may be adiabatic and a specified, spatially varying heat generation rate can be applied in each of the domains. The solutions are found to be in agreement with known solutions for simpler geometries. The analytical solution presented here is very general in that it takes into account the interface resistances between the layers. One application of this analytical study relates to the thermal management of a 3-D stack of devices and interconnect layers. Another possible application is to the study of hotspots in a chip stack with non uniform heat generation. Many other potential applications may also be simulated.


2009 ◽  
Vol 36 (4) ◽  
pp. 1112-1119 ◽  
Author(s):  
Juan A. López Molina ◽  
María J. Rivera ◽  
Macarena Trujillo ◽  
Enrique J. Berjano

Author(s):  
Bo Dan ◽  
James F. Geer ◽  
Bahgat G. Sammakia

The current paper presents the results of an analytical study of steady state heat conduction in a rectangular tube with eccentric hot spots on both the top and the bottom surfaces. The rectangular domain is assumed to be adiabatic on the lateral surfaces and a single or multiple eccentric hot spots can be applied on the top and bottom surfaces. Isothermal, heat flux or convection boundary conditions can be applied on the hot spots. Because the hot spots are eccentric, the spreading resistance becomes a dominant factor in heat conduction in the tube. The multiple hot spots, multiple layer and combination problems are also studied in the current paper. The solutions can be applied to the thermal management of three-dimensional stacks of electronic devices, the interconnect layers and the thermoelectric devices.


2015 ◽  
Vol 67 ◽  
pp. 667-674 ◽  
Author(s):  
Weiping Zhu ◽  
Xiujuan Xie ◽  
Huihui Yang ◽  
Laifeng Li ◽  
Linghui Gong

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