scholarly journals Focused ion beam fabrication of metallic nanostructures on end faces of optical fibers for chemical sensing applications

Author(s):  
A. Dhawan ◽  
J. F. Muth ◽  
D. N. Leonard ◽  
M. D. Gerhold ◽  
J. Gleeson ◽  
...  
2008 ◽  
Vol 14 (S2) ◽  
pp. 988-989 ◽  
Author(s):  
PE Russell ◽  
A Dhawan ◽  
J Gleeson

Extended abstract of a paper presented at Microscopy and Microanalysis 2008 in Albuquerque, New Mexico, USA, August 3 – August 7, 2008


2013 ◽  
Vol 1530 ◽  
Author(s):  
A. Bendavid ◽  
L. Wieczorek ◽  
R. Chai ◽  
J. S. Cooper ◽  
B. Raguse

ABSTRACTA large area nanogap electrode fabrication method combinig conventional lithography patterning with the of focused ion beam (FIB) is presented. Lithography and a lift-off process were used to pattern 50 nm thick platinum pads having an area of 300 μm × 300 μm. A range of 30-300 nm wide nanogaps (length from 300 μm to 10 mm ) were then etched using an FIB of Ga+ at an acceleration voltage of 30 kV at various beam currents. An investigation of Ga+ beam current ranging between 1-50 pA was undertaken to optimise the process for the current fabrication method. In this study, we used Monte Carlo simulation to calculate the damage depth in various materials by the Ga+. Calculation of the recoil cascades of the substrate atoms are also presented. The nanogap electrodes fabricated in this study were found to have empty gap resistances exceeding several hundred MΩ. A comparison of the gap length versus electrical resistance on glass substrates is presented. The results thus outline some important issues in low-conductance measurements. The proposed nanogap fabrication method can be extended to various sensor applications, such as chemical sensing, that employ the nanogap platform. This method may be used as a prototype technique for large-scale fabrication due to its simple, fast and reliable features.


2021 ◽  
Author(s):  
Karen Sloyan ◽  
Henrik Melkonyan ◽  
Harry Apostoleris ◽  
Marcus Dahlem ◽  
Matteo Chiesa ◽  
...  

Author(s):  
Stephen C. Warren-Smith ◽  
Ricardo M. André ◽  
Jan Dellith ◽  
Manfred Rothhardt ◽  
Hartmut Bartelt

2012 ◽  
Vol 626 ◽  
pp. 867-877 ◽  
Author(s):  
Q. Humayun ◽  
U. Hashim

Fabrication techniques for Metal-molecule-metal junction electrodes suitable to study electron tunneling through metal junctions are reviewed. The applications of current technologies such as mechanical break junction, electromigration, shadow mask lithography, focused ion beam deposition, chemical and electrochemical plating, electron-beam lithography, in fabricating vacant junction electrodes are briefly described. For biomolecular sensing applications, the size of the junction electrodes must be small enough to allow the biomolecule inserted into the junction space to connect both leads to keep the molecules in a relaxed and undistorted state. A significant advantage of using Metal-molecule-metal junction electrodes devices is that the junction can be characterized with and without the molecule in place. Any electrical artifacts introduced by the electrode fabrication process are more easily deconvoluted from the intrinsic properties of the molecule.


2018 ◽  
Vol 195 ◽  
pp. 41-49 ◽  
Author(s):  
Filippo Pisano ◽  
Marco Pisanello ◽  
Leonardo Sileo ◽  
Antonio Qualtieri ◽  
Bernardo L. Sabatini ◽  
...  

2014 ◽  
Vol 22 (11) ◽  
pp. 13102 ◽  
Author(s):  
Ricardo M. André ◽  
Simon Pevec ◽  
Martin Becker ◽  
Jan Dellith ◽  
Manfred Rothhardt ◽  
...  

2013 ◽  
Vol 319 ◽  
pp. 54-57
Author(s):  
Dae Keun Choi ◽  
Sang Hoon Lee

In this paper, the properties of Focused-Ion-Beam (FIB) deposited platinum layer are investigated using the MEMS processes. First, the electrical properties are examined with three parallel metal lines and the measurement result shows over one hundred times larger resistivity than that of the conventional platinum layer. This feature is due to the additional materials like carbon compound and the gallium ion. The thermal properties are also investigated about the temperature coefficient of resistivity (TCR). The measured TCR values are -0.0015~-0.0020 K-1 which are different from the positive TCR in conventional platinum layer. The carbon compound has negative TCR and changes the properties of FIB metal layer. Although some non-uniform properties are observed, the properties of FIB deposited platinum layer are sufficient for the temperature sensing applications at small area.


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