Plasma and surface reactions for obtaining low defect density amorphous silicon at high growth rates

1998 ◽  
Vol 16 (1) ◽  
pp. 365-368 ◽  
Author(s):  
Akihisa Matsuda
2000 ◽  
Vol 266-269 ◽  
pp. 450-454 ◽  
Author(s):  
Yoram Lubianiker ◽  
Yanyang Tan ◽  
J.David Cohen ◽  
Gautam Ganguly

2002 ◽  
Vol 715 ◽  
Author(s):  
B.A. Korevaar ◽  
C. Smit ◽  
A.M.H.N. Petit ◽  
R.A.C.M.M. van Swaaij ◽  
M.C.M. van de Sanden

AbstractA cascaded arc expanding thermal plasma is used to deposit intrinsic hydrogenated amorphous silicon at growth rates between 0.2 and 3 nm/s. Incorporation into a single junction p-i-n solar cell resulted in an initial efficiency of 6.7%, whereas all the optical and initial electrical properties of the individual layers are comparable with RF-PECVD deposited films. In this cell the intrinsic layer was deposited at 0.85 nm/s and at a deposition temperature of 250°C, which is the temperature limit for growing the p-i-n sequence. The cell efficiency is limited by the fill factor and using a buffer layer at the p-i interface deposited with RF-PECVD at low growth rate can increase this. The increase in fill factor is a result of a lower initial defect density near the p-i interface then obtained with the expanding thermal plasma, resulting in better charge carrier collection. To use larger growth rates, while maintaining the material properties, higher deposition temperatures are required. Higher deposition temperatures result in a smaller optical bandgap for the intrinsic layer and deterioration of the p-type layer, resulting in a lower opencircuit voltage. First results on applying a buffer layer will also be presented.


1999 ◽  
Vol 557 ◽  
Author(s):  
Yoram Lubianiker ◽  
Yanyang Tan ◽  
J. David Cohen ◽  
Gautam Ganguly

AbstractIntrinsic a-Si:H samples were grown with and without hydrogen (H2) dilution of silane at different growth rates. We find that the dilution leads to a considerable reduction in the defect density, in particular at high growth rates. The defect density is particularly low for samples grown using H2 dilution conditions at growth rates as high as 10 Å/sec. Using transient photocapacitance measurements we find evidence for a small concentration of microcrystallites embedded in the amorphous films. An increase in the microcrystalline fraction correlates with a decrease in the defect density.


2014 ◽  
Vol 778-780 ◽  
pp. 117-120 ◽  
Author(s):  
Hiroaki Fujibayashi ◽  
Masahiko Ito ◽  
Hideki Ito ◽  
Isaho Kamata ◽  
Masami Naitou ◽  
...  

A single wafer type 150 mm vertical 4H-SiC epitaxial reactor with high-speed wafer rotation was developed. The rotation of the wafer at high speed significantly enhances the growth rate, and high growth rates of 40–50 μm/h are possible on 4°off-cut 4H-SiC substrates. In addition, a low defect density and smooth surface without macro step bunching can be achieved. Excellent uniformity of thickness and doping concentration was obtained for a 150 mm wafer at a high growth rate of 50 μm/h.


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