Three-beam conjugate enhanced micro-vibration detection

2021 ◽  
Vol 60 (10) ◽  
Author(s):  
Xinxin Kong ◽  
Libin Xiang ◽  
Qisheng Cai ◽  
Wenxi Zhang ◽  
Zhou Wu ◽  
...  
2017 ◽  
Author(s):  
XiaoDong Qin ◽  
Feng Pan ◽  
ZongHui Chen ◽  
XueQin Hou ◽  
Wen Xiao

2014 ◽  
Vol 7 (6) ◽  
pp. 917-924
Author(s):  
乐国庆 LE Guo-qing ◽  
郭永飞 GUO Yong-fei ◽  
刘春香 LIU Chun-xiang ◽  
马天波 MA Tian-bo ◽  
石俊霞 SHI Jun-xia

Nanoscale ◽  
2019 ◽  
Vol 11 (12) ◽  
pp. 5737-5745 ◽  
Author(s):  
Tie Li ◽  
Lili Li ◽  
Yuanyuan Bai ◽  
Yudong Cao ◽  
Qifeng Lu ◽  
...  

Hierarchical nanovesicle-like hollow microspheres are employed to fabricate flexible pressure sensors for detecting micro-vibration signals in non-contacting mode.


2013 ◽  
Vol 643 ◽  
pp. 149-152
Author(s):  
Meng Chao Li ◽  
Zhong Hai He

External micro vibration is an important obstacle factor for the measuring result of scanning tunneling microscopy. In order to achieve better result, the influence of vibration must be eliminated. In this study, a large range new sensor with two nano stages is built up to detect the micro vibration for the compensation of the results. Finnaly, the vibration detection experiments are made to illustrate the rationality of the sensor.


2011 ◽  
Vol 480-481 ◽  
pp. 883-886
Author(s):  
Meng Chao Li

Scanning tunneling microscopy is a precise nano measuring machine, and high precision means the influence factors of scanning tunneling microscopy is important to the measurement result. The micro vibration is an obvious interferential factor to scanning tunneling microscopy, especially the low frequency vibration. In order to avoid the influence of vibration, the vibration detection in the tunneling state and vibration compensation are key aspect and are one passive approach to improve the measurement accuracy.


2011 ◽  
Vol 306-307 ◽  
pp. 180-184
Author(s):  
Takayuki Nara ◽  
Kouki Oku ◽  
Hirofumi Fukai ◽  
Hideki Hatagouchi ◽  
Yasushiro Nishioka

A new silicon MEMS process has been proposed utilizing anodic bonding of an extremely thin silicon film (60 m) on a glass substrate, followed by photo lithographically defining micro spring structures on the silicon film and dry etching the silicon film using an inductively coupled plasma (ICP) dry etcher. After that, the underneath glass was selectively etched off using a hydrofluoric (HF) solution to release the micro spring. This technique was successfully applied to a micro vibration detection sensor with the silicon microspring with a cross section of 10 m x 60 m with a length longer than 500 m.


2010 ◽  
Vol 130 (5) ◽  
pp. 844-851 ◽  
Author(s):  
Yosuke Kurihara ◽  
Kosuke Masuyama ◽  
Testuo Nakamura ◽  
Takeshi Bamba ◽  
Kajiro Watanabe

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