A novel method for fabricating curved frequency selective surface via 3D printing technology

A dental implant surgical guide fabricated by 3-dimensional (3D) printing technology is widely used in clinical practice due to its convenience and fast fabrication. However, the 3D printing technology produces an incorrect guide hole due to the shrinkage of the resin materials, and in order to solve this, the guide hole is adjusted using a trimmer or a metal sleeve is attached to the guide hole. These methods can lead to another inaccuracy. The present method reports a technique to compensate for a decreased guide hole caused by shrinkage that can occur when a computer-guided implant surgical guide is fabricated with a 3D printer. The present report describes a technique to adjust the size of the guide hole using a free software program to identify the optimized guide hole size that is fabricated with the 3D printer.

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Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless Packaging

Journal of Microelectronics and Electronic Packaging ◽

10.4071/imaps.660476 ◽

2018 ◽

Vol 15 (3) ◽

pp. 101-106

Author(s):

Bijan K. Tehrani ◽

Ryan A. Bahr ◽

Manos M. Tentzeris

Keyword(s):

3D Printing ◽

Millimeter Wave ◽

Integrated Circuit ◽

Coplanar Waveguide ◽

Frequency Selective Surface ◽

60 Ghz ◽

Low Loss ◽

Printing Technology ◽

3D Printing Technology ◽

Application Specific

Abstract This article outlines the design, processing, and implementation of inkjet and 3D printing technologies for the development of fully printed, highly integrated millimeter-wave (mm-wave) wireless packages. The materials, tools, and processes of each technology are outlined and justified for their respective purposes. Inkjet-printed 3D interconnects directly interfacing a packaging substrate with an integrated circuit (IC) die are presented using printed dielectric ramps and coplanar waveguide transmission lines exhibiting low loss (.6–.8 dB/mm at 40 GHz). Stereolithography 3D printing is presented for the encapsulation of IC dice, enabling the application-specific integration of on-package structures, including dielectric lenses and frequency selective surface–based wireless filters. Finally, inkjet and 3D printing technology are combined to present sloped mm-wave interconnects through an encapsulant, or through mold vias, achieving a slope of up to 65° and low loss (.5–.6 dB/mm at 60 GHz). The combination of these additive techniques is highlighted for the development of scalable, application-specific wireless packages.

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Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless Packaging

International Symposium on Microelectronics ◽

10.4071/isom-2017-wa36_162 ◽

2017 ◽

Vol 2017 (1) ◽

pp. 000252-000257 ◽

Cited By ~ 1

Author(s):

Bijan K. Tehrani ◽

Ryan A. Bahr ◽

Manos M. Tentzeris

Keyword(s):

3D Printing ◽

Millimeter Wave ◽

Transmission Lines ◽

Coplanar Waveguide ◽

Frequency Selective Surface ◽

60 Ghz ◽

Low Loss ◽

Printing Technology ◽

3D Printing Technology ◽

Application Specific

Abstract This paper outlines the design, processing, and implementation of inkjet and 3D printing technologies for the development of fully-printed, highly-integrated millimeter-wave (mm-wave) wireless packages. The materials, tools, and processes of each technology are outlined and justified for their respective purposes. Inkjet-printed 3D interconnects directly interfacing a packaging substrate with an IC die are presented using printed dielectric ramps and coplanar waveguide (CPW) transmission lines exhibiting low loss (0.6–0.8 dB/mm at 40 GHz). Stereolithography (SLA) 3D printing is presented for the encapsulation of IC dies, enabling the application-specific integration of on-package structures, including dielectric lenses and frequency selective surface (FSS)-based wireless filters. Finally, inkjet and 3D printing technology are combined to present sloped mm-wave interconnects through an encapsulation, or through-mold vias (TMVs), achieving a slope up to 65° and low loss (0.5–0.6 dB/mm at 60 GHz). The combination of these additive techniques is highlighted for the development of scalable, application-specific wireless packages.

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