Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless Packaging

2017 ◽  
Vol 2017 (1) ◽  
pp. 000252-000257 ◽  
Author(s):  
Bijan K. Tehrani ◽  
Ryan A. Bahr ◽  
Manos M. Tentzeris
Keyword(s):  
3D Printing ◽  
Millimeter Wave ◽  
Transmission Lines ◽  
Coplanar Waveguide ◽  
Frequency Selective Surface ◽  
60 Ghz ◽  
Low Loss ◽  
Printing Technology ◽  
3D Printing Technology ◽  
Application Specific

Abstract This paper outlines the design, processing, and implementation of inkjet and 3D printing technologies for the development of fully-printed, highly-integrated millimeter-wave (mm-wave) wireless packages. The materials, tools, and processes of each technology are outlined and justified for their respective purposes. Inkjet-printed 3D interconnects directly interfacing a packaging substrate with an IC die are presented using printed dielectric ramps and coplanar waveguide (CPW) transmission lines exhibiting low loss (0.6–0.8 dB/mm at 40 GHz). Stereolithography (SLA) 3D printing is presented for the encapsulation of IC dies, enabling the application-specific integration of on-package structures, including dielectric lenses and frequency selective surface (FSS)-based wireless filters. Finally, inkjet and 3D printing technology are combined to present sloped mm-wave interconnects through an encapsulation, or through-mold vias (TMVs), achieving a slope up to 65° and low loss (0.5–0.6 dB/mm at 60 GHz). The combination of these additive techniques is highlighted for the development of scalable, application-specific wireless packages.

Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless Packaging

2018 ◽  
Vol 15 (3) ◽  
pp. 101-106
Author(s):  
Bijan K. Tehrani ◽  
Ryan A. Bahr ◽  
Manos M. Tentzeris
Keyword(s):  
3D Printing ◽  
Millimeter Wave ◽  
Integrated Circuit ◽  
Coplanar Waveguide ◽  
Frequency Selective Surface ◽  
60 Ghz ◽  
Low Loss ◽  
Printing Technology ◽  
3D Printing Technology ◽  
Application Specific

Abstract This article outlines the design, processing, and implementation of inkjet and 3D printing technologies for the development of fully printed, highly integrated millimeter-wave (mm-wave) wireless packages. The materials, tools, and processes of each technology are outlined and justified for their respective purposes. Inkjet-printed 3D interconnects directly interfacing a packaging substrate with an integrated circuit (IC) die are presented using printed dielectric ramps and coplanar waveguide transmission lines exhibiting low loss (.6–.8 dB/mm at 40 GHz). Stereolithography 3D printing is presented for the encapsulation of IC dice, enabling the application-specific integration of on-package structures, including dielectric lenses and frequency selective surface–based wireless filters. Finally, inkjet and 3D printing technology are combined to present sloped mm-wave interconnects through an encapsulant, or through mold vias, achieving a slope of up to 65° and low loss (.5–.6 dB/mm at 60 GHz). The combination of these additive techniques is highlighted for the development of scalable, application-specific wireless packages.

A comparative study on four different transmission lines in LTCC for 60 GHz applications

2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000191-000198 ◽  
Author(s):  
A. Isapour ◽  
D. Bahloul ◽  
A. B. Kouki
Keyword(s):  
Transmission Lines ◽  
Coplanar Waveguide ◽  
Data Rate ◽  
High Data Rate ◽  
60 Ghz ◽  
Low Loss ◽  
Great Opportunity ◽  
High Data ◽  
Wireless Telecommunication ◽  
5 Ghz

Abstract The wireless telecommunication systems have an undeniable role in today's society. The rapid progress of wireless services and applications accelerates demands for high data-rate reliable systems. The 60 GHz band with its 5 GHz globally unlicensed available spectrum, provides a great opportunity for the next generation of high data-rate wireless communication. Despite this attractive bandwidth surrounding 60 GHz, there are still many challenges to be addressed such as the loss performance and the integration with other systems. Low Temperature Cofired Ceramic (LTCC) technology, with its unique and mature multilayer fabrication process, has excellent capability of realizing miniaturized 3D low loss structures to overcome these challenges. Since, one of the key components in any communication system for both interconnecting and designing components is Low loss transmission lines, in this article we overview the performances and challenges for four different most practical transmission lines at 60 GHz in LTCC: Microstrip, Stripline, Coplanar Waveguide (CPW), and LTCC Integrated Waveguide (LIW).

scholarly journals Review of 3D Printed Millimeter-Wave and Terahertz Passive Devices

2017 ◽  
Vol 2017 ◽  
pp. 1-10 ◽  
Author(s):  
Bing Zhang ◽  
Wei Chen ◽  
Yanjie Wu ◽  
Kang Ding ◽  
Rongqiang Li
Keyword(s):  
Surface Roughness ◽  
3D Printing ◽  
Millimeter Wave ◽  
Design Methodology ◽  
Device Fabrication ◽  
Printing Technology ◽  
Dimensional Tolerance ◽  
3D Printing Technology ◽  
Passive Devices ◽  
3D Printed

The 3D printing technology is catching attention nowadays. It has certain advantages over the traditional fabrication processes. We give a chronical review of the 3D printing technology from the time it was invented. This technology has also been used to fabricate millimeter-wave (mmWave) and terahertz (THz) passive devices. Though promising results have been demonstrated, the challenge lies in the fabrication tolerance improvement such as dimensional tolerance and surface roughness. We propose the design methodology of high order device to circumvent the dimensional tolerance and suggest specific modelling of the surface roughness of 3D printed devices. It is believed that, with the improvement of the 3D printing technology and related subjects in material science and mechanical engineering, the 3D printing technology will become mainstream for mmWave and THz passive device fabrication.

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