Weak reflectivity measurement of FBGs by method of grating scale

Author(s):  
Qiushi Qin ◽  
Meng Wang ◽  
Binyu Rao ◽  
Zefeng Wang
2013 ◽  
Vol 24 (10) ◽  
pp. 105102 ◽  
Author(s):  
Zhihui Luo ◽  
Hongqiao Wen ◽  
Xiaofu Li ◽  
Huiyong Guo

2015 ◽  
Vol 4 (4) ◽  
Author(s):  
Hiroo Kinoshita ◽  
Takeo Watanabe ◽  
Tetsuo Harada

AbstractThirty years have passed since the first report on extreme ultraviolet lithography (EUVL) was presented at the annual meeting of the Japanese Society of Applied Physics in 1986. This technology is now in the manufacturing development stage. The high-volume manufacturing of dynamic-random-access-memory (DRAM) chips with a line width of 15 nm is expected in 2016. However, there are critical development issues that remain: generating a stand-alone EUV source with a higher power and producing a mask inspection tool for obtaining zero-defect masks. The Center for EUVL at the University of Hyogo was established in 2010. At present, it utilizes various types of equipment, such as an EUV mask defect inspection tool, an interference-lithography system, a device for measuring the thickness of carbon contamination film deposited by resist outgassing, and reflectivity measurement systems.


2015 ◽  
Vol 29 (4) ◽  
pp. 1028-1040 ◽  
Author(s):  
Vahid Balali ◽  
Mohammad Amin Sadeghi ◽  
Mani Golparvar-Fard

2009 ◽  
Vol 167 (1) ◽  
pp. 101-105 ◽  
Author(s):  
Y. F. Yano ◽  
T. Uruga ◽  
H. Tanida ◽  
H. Toyokawa ◽  
Y. Terada ◽  
...  

2016 ◽  
Vol 9 (2) ◽  
pp. 263-269 ◽  
Author(s):  
苗少峰 MIAO Shao-feng ◽  
李晨旭 LI Chen-xu ◽  
高 苗 GAO Miao ◽  
邵晓鹏 SHAO Xiao-peng ◽  
史学舜 SHI Xue-shun ◽  
...  

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