High resolution patterning in chemically amplified resists: the effect of film thickness

2001 ◽  
Author(s):  
David R. Medeiros ◽  
Wayne M. Moreau ◽  
Karen E. Petrillo ◽  
Maharshi Chauhan ◽  
Wu-Song Huang ◽  
...  
Keyword(s):  
High Resolution ◽  
Film Thickness ◽  
Chemically Amplified ◽  
Chemically Amplified Resists

Effects of film thickness and alkaline concentration on dissolution kinetics of poly(4-hydroxystyrene) in alkaline aqueous solution

2022 ◽  
Author(s):  
Naoki Tanaka ◽  
Kyoko Matsuoka ◽  
Takahiro KOZAWA ◽  
Takuya Ikeda ◽  
Yoshitaka Komuro ◽  
...  
Keyword(s):  
Aqueous Solution ◽  
Film Thickness ◽  
Thick Films ◽  
Dissolution Kinetics ◽  
Dissolution Behavior ◽  
Chemically Amplified ◽  
Fundamental Understanding ◽  
Chemically Amplified Resists ◽  
Kinetics Of ◽  
Simple Combination

Abstract The dissolution behavior of a simple combination of poly(4-hydroxystyrene) (PHS) films and tetramethylammonium hydroxide (TMAH) aqueous solution was analyzed to gain a fundamental understanding of the effects of film thickness and alkaline concentration on the dissolution kinetics of chemically amplified resists (CARs). Films of four different thicknesses, from thick (approximately 900 nm) to thin (approximately 50 nm), were developed in 22 different developers of different concentrations. The dissolution behavior of each combination was observed using a quartz crystal microbalance (QCM). Differences in dissolution kinetics due to film thickness were observed even between relatively thick films such as 900- and 500-nm thick films in dilute developers. These differences were considered to be caused by the diffusion of the solution into the films. Thin films also showed characteristic behavior with dilution. This behavior was due to the interaction between the substrate and the films, unlike in the case of thick films.

Chemically amplified resists for high-resolution lithography

2013 ◽  
Vol 42 (3) ◽  
pp. 165-175 ◽  
Author(s):  
S. A. Bulgakova ◽  
M. M. Jons ◽  
A. E. Pestov ◽  
M. N. Toropov ◽  
N. I. Chkhalo ◽  
...  
Keyword(s):  
High Resolution ◽  
Chemically Amplified ◽  
Chemically Amplified Resists

Silylation and Dry Development of Chemically Amplified Resists SAL601*, AZPN114*1, and Epoxidised Resist (EPR*1) for High Resolution Electron-Beam Lithography

1998 ◽  
Vol 37 (Part 1, No. 12B) ◽  
pp. 6873-6876 ◽  
Author(s):  
Evangelia Tegou ◽  
Evangelos Gogolides ◽  
Panagiotis Argitis ◽  
Ioannis Raptis ◽  
Giancarlo Meneghini ◽  
...  
Keyword(s):  
Electron Beam ◽  
High Resolution ◽  
Electron Beam Lithography ◽  
Chemically Amplified ◽  
Resolution Electron ◽  
Chemically Amplified Resists

High-Resolution Hybrid Lithography with Negative Tone Chemically Amplified Resists

2004 ◽  
Vol 43 (6B) ◽  
pp. 3974-3980 ◽  
Author(s):  
S. Landis ◽  
S. Pauliac ◽  
J. Saint-Pol ◽  
C. Gourgon ◽  
M. Akita ◽  
...  
Keyword(s):  
High Resolution ◽  
Chemically Amplified ◽  
Negative Tone ◽  
Chemically Amplified Resists

scholarly journals Effect of Polymer Protection and Film Thickness on Acid Generator Distribution in Chemically Amplified Resists

2009 ◽  
Vol 22 (1) ◽  
pp. 105-109 ◽  
Author(s):  
Takehiro Fukuyam ◽  
Takahiro Kozawa ◽  
Hiroki Yamamoto ◽  
Seiichi Tagawa ◽  
Makiko Irie ◽  
...  
Keyword(s):  
Film Thickness ◽  
Chemically Amplified ◽  
Chemically Amplified Resists

Approach for High-resolution of Chemically Amplified Resists Using Rate Editor Software

2003 ◽  
Vol 42 (Part 1, No. 1) ◽  
pp. 16-22 ◽  
Author(s):  
Atsushi Sekiguchi ◽  
Yoshihisa Sensu ◽  
Yasuhiro Miyake
Keyword(s):  
High Resolution ◽  
Chemically Amplified ◽  
Chemically Amplified Resists
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