Characterization of electronic packaging materials and components by image correlation methods

Author(s):  
Dietmar Vogel ◽  
Juergen Auersperg ◽  
Bernd Michel
2014 ◽  
Vol 11 (03) ◽  
pp. 1343002 ◽  
Author(s):  
GIULIO MAIER ◽  
VLADIMIR BULJAK ◽  
TOMASZ GARBOWSKI ◽  
GIUSEPPE COCCHETTI ◽  
GIORGIO NOVATI

A survey is presented herein of some recent research contributions to the methodology of inverse structural analysis based on statical tests for diagnosis of possibly damaged structures and for mechanical characterization of materials in diverse industrial environments. The following issues are briefly considered: identifications of parameters in material models and of residual stresses on the basis of indentation experiments; mechanical characterization of free-foils and laminates by cruciform and compression tests and digital image correlation measurements; diagnosis, both superficially and in depth, of concrete dams, possibly affected by alkali-silica-reaction or otherwise damaged.


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