Photoacoustic characterization of the mechanical properties of thin film materials

2005 ◽  
Author(s):  
Feifei Zhang ◽  
Sridhar Krishnaswamy ◽  
Dong Fei ◽  
Douglas A. Rebinsky
Author(s):  
Gyeung Ho Kim ◽  
Mehmet Sarikaya ◽  
D. L. Milius ◽  
I. A. Aksay

Cermets are designed to optimize the mechanical properties of ceramics (hard and strong component) and metals (ductile and tough component) into one system. However, the processing of such systems is a problem in obtaining fully dense composite without deleterious reaction products. In the lightweight (2.65 g/cc) B4C-Al cermet, many of the processing problems have been circumvented. It is now possible to process fully dense B4C-Al cermet with tailored microstructures and achieve unique combination of mechanical properties (fracture strength of over 600 MPa and fracture toughness of 12 MPa-m1/2). In this paper, microstructure and fractography of B4C-Al cermets, tested under dynamic and static loading conditions, are described.The cermet is prepared by infiltration of Al at 1150°C into partially sintered B4C compact under vacuum to full density. Fracture surface replicas were prepared by using cellulose acetate and thin-film carbon deposition. Samples were observed with a Philips 3000 at 100 kV.


2015 ◽  
Vol 662 ◽  
pp. 87-90
Author(s):  
Petr Haušild ◽  
Michal Landa

NiTi shape memory alloy thin film sputter-deposited on a large scale silicon wafer was characterized by means of instrumented (depth-sensing) indentation technique. Thickness of deposited thin film was measured by calotest device. Microstructure of thin film was observed using differential interference (Nomarski) contrast. It was shown that the local mechanical properties are different in areas containing different phases (austenite and martensite) according to different deposition conditions (kinetic energy of deposited atoms when impacting the substrate surface).


2020 ◽  
Vol 22 (3) ◽  
pp. 142-149
Author(s):  
T. Oellers ◽  
V. G. Arigela ◽  
C. Kirchlechner ◽  
G. Dehm ◽  
A. Ludwig

2013 ◽  
Vol 231 ◽  
pp. 332-336 ◽  
Author(s):  
Pao-Sheng Chen ◽  
Hsien-Wei Chen ◽  
Jenq-Gong Duh ◽  
Jyh-Wei Lee ◽  
Jason Shian-Ching Jang

2019 ◽  
Vol 33 (8) ◽  
pp. 263-268
Author(s):  
Myung Rae Cho ◽  
Young Duck Kim ◽  
Byung Yang Lee ◽  
Seunghun Hong ◽  
Yun Daniel Park

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