“Wetting” Phase Transitions by the Second Solid Phase for Linear Defects (Grain Boundary Triple Junctions)

JETP Letters ◽  
2020 ◽  
Vol 112 (4) ◽  
pp. 257-261 ◽  
Author(s):  
A. B. Straumal ◽  
I. A. Mazilkin ◽  
K. V. Tsoi ◽  
B. Baretzky ◽  
B. B. Straumal
Keyword(s):  
Phase Transitions ◽  
Grain Boundary ◽  
Solid Phase ◽  
Triple Junctions ◽  
Linear Defects ◽  
Boundary Triple

Wandering and nanolaminated structures of grain boundary triple junctions in tungsten

2020 ◽  
Vol 260 ◽  
pp. 126980
Author(s):  
T.I. Mazilova ◽  
E.V. Sadanov ◽  
I.V. Starchenko ◽  
I.M. Mikhailovskij
Keyword(s):  
Grain Boundary ◽  
Triple Junctions ◽  
Boundary Triple

scholarly journals Energetics and structure of grain boundary triple junctions in graphene

2017 ◽  
Vol 7 (1) ◽  
Author(s):  
Petri Hirvonen ◽  
Zheyong Fan ◽  
Mikko M. Ervasti ◽  
Ari Harju ◽  
Ken R. Elder ◽  
...  
Keyword(s):  
Grain Boundary ◽  
Triple Junctions ◽  
Boundary Triple

Evaluation of Plastic Work Density, Strain Energy and Slip Multiplication Intensity at Some Typical Grain Boundary Triple Junctions

2010 ◽  
Vol 654-656 ◽  
pp. 1283-1286 ◽  
Author(s):  
Tetsuya Ohashi ◽  
Michihiro Sato ◽  
Yuhki Shimazu
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Crystal Plasticity ◽  
Strain Energy ◽  
Plastic Work ◽  
Slip Systems ◽  
Triple Junctions ◽  
Plastic Slip ◽  
Boundary Triple

Plastic slip deformations of tricrystals with simplified geometries are numerically analyzed by a FEA-based crystal plasticity code. Accumulation of geometrically necessary (GN) dislocations, distributions of the total slip, plastic work density and GN dislocations on slip systems, as well as some indices for the intensity of slip multiplication are evaluated. Results show that coexistence of GN dislocations on different slip systems is prominent at triple junctions of grain boundaries.

Characterization of the early stages of electromigration at grain boundary triple junctions

1991 ◽  
Vol 58 (21) ◽  
pp. 2354-2356 ◽  
Author(s):  
M. Genut ◽  
Z. Li ◽  
C. L. Bauer ◽  
S. Mahajan ◽  
P. F. Tang ◽  
...  
Keyword(s):  
Grain Boundary ◽  
Triple Junctions ◽  
Early Stages ◽  
Boundary Triple

High Density Bands of GN Dislocations Formed by Multi Body Interaction in Compatible Type Multi Crystal Models

2007 ◽  
Vol 340-341 ◽  
pp. 187-192 ◽  
Author(s):  
Ryouji Kondou ◽  
Tetsuya Ohashi
Keyword(s):  
Finite Element ◽  
Grain Boundary ◽  
Shape Change ◽  
Tensile Load ◽  
High Density ◽  
Triple Junctions ◽  
Uniform Deformation ◽  
Boundary Triple ◽  
Slip Deformation ◽  
Multi Body

Slip deformation phenomena in compatible type multi crystal models subjected to tensile load are analyzed by a finite element crystal plasticity analysis code, and accumulation of geometrically-necessary and statistically-stored dislocations (GNDs and SSDs) are evaluated in detail. Crystal orientations for the grains are chosen so that mutual constraint of deformation through grain boundary planes does not take place. We call these models as compatible type multi crystals, because “compatibility requirements” at grain boundaries are automatically maintained by slip deformation only on the primary systems and uniform deformation is expected to occur in each grain. Results of the analysis, however, show non-uniform deformation with high density of GNDs accumulated in a form of band. Growth of such kind of structure of GNDs caused localized accumulation of SSDs at grain boundary triple junctions. Mechanism for the band-shaped accumulation of GNDs in the compatible type multi crystals are discussed from the viewpoint of multi body interactions which arise from shape change of crystal grains after slip deformation.

Line Tension of Grain Boundary Triple Junctions in the Copper Tricrystals

2014 ◽  
pp. 1063-1068
Author(s):  
Bingbing Zhao ◽  
Lasar Shvindlerman ◽  
Günter Gottstein
Keyword(s):  
Grain Boundary ◽  
Line Tension ◽  
Triple Junctions ◽  
Boundary Triple

Grain Boundary Characteristics and Stress-induced Damage Morphologies in Sputtered and Electroplated Copper Films

2003 ◽  
Vol 766 ◽  
Author(s):  
Hyun Park ◽  
Soo-Jung Hwang ◽  
Kyu Hwan Oh ◽  
Young-Chang Joo
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Morphological Difference ◽  
High Energy ◽  
Triple Junctions ◽  
Boundary Area ◽  
Boundary Triple ◽  
Surface Damages ◽  
Grain Boundary Characteristics ◽  
Boundary Characteristics

AbstractVarious Cu films were fabricated using sputtering and electroplating with and without additive, and their surface damages after annealing were investigated. After annealing at 435°C, the difference between damage morphologies of the films was observed. In some films stressinduced grooves along the grain boundaries were observed, while in the others voids at the grain boundary triple junctions were observed. It was also observed that the stress-induced groove was formed along the high energy grain boundaries. To explain the morphological difference of surface damages, a simple parameter considering the contributions of grain structures and grain boundary characteristics to surface and grain boundary diffusions is suggested. The effective grain boundary area, which is a function of grain size, film thickness and the fraction of high energy grain boundaries, played a key role in the morphological difference.

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