Herein, two-dimensional (2D) single-action die compaction process of copper (Cu) powder was simulated by the multiparticle finite element method (MPFEM) at particulate scale. The initial packing structure, generated by the discrete element method (DEM), was used as an input for the FEM model, where the mesh division of each particle was discretized. The evolution of macro- and microscopic properties, such as relative density, stress distribution, particle deformation, void filling behavior, and force transmission, during compaction and pressure release processes have been systematically studied. The results revealed that the force is mainly concentrated on largely deformed regions of the particles during compaction and formed a contact force network, which hindered the densification process. In the compact, the shorter side of the large void edges rendered higher stress than the longer side. On the other hand, the stress distribution of small void edges remained uniform. After pressure release, large residual stress was observed at the contact area of the adjacent particles and the maximum stress was observed at the particles’ edges. Moreover, the residual stress did not proceed to the interior of the particles. Meanwhile, the stress of large void edges has been completely released but exhibited a nonuniform distribution. The smaller fraction of void filling resulted in a larger reduction of the released stress after pressure removal. Also, the particles closer to the upper die exhibited higher average equivalent von Mises stress inside the particles during compaction and pressure release processes.
Analysis of the Shape of the Fish-Eye Formed under Residual Stress Distribution Using the Finite-Element Method
