Influence of grain size distribution on the lattice thermal conductivity of Bi2Te3-Sb2Te3-based nanostructured materials

2013 ◽  
Vol 55 (12) ◽  
pp. 2442-2449 ◽  
Author(s):  
L. P. Bulat ◽  
V. B. Osvenskii ◽  
D. A. Pshenai-Severin
Author(s):  
Enze Jin ◽  
Chen Liu ◽  
Heming He

The thermal conductivity is one of the most important properties for UO2. The influences of microstructure are especially important for UO2 due to the severe structural changes under irradiation conditions. In this study, we have investigated the thermal conductivity of UO2 with different microstructures using Finite Element Method. The thermal conductivity increases with increasing grain size. The grain size distribution has obvious influence on the thermal conductivity especially when there are pores in the polycrystal. The influences of porosity and pore size are very sensitive to the position of the pores. The results obtained in this study are useful for prediction of property changes of UO2 fuel in pile and important to gain some design guidance to tune the properties through the control of the microstructure.


2018 ◽  
Vol 17 (1) ◽  
pp. 180026 ◽  
Author(s):  
T.K.K. Chamindu Deepagoda ◽  
Kathleen Smits ◽  
J.R.R.N. Jayarathne ◽  
Benjamin M. Wallen ◽  
Timothy J. Clough

2018 ◽  
Vol 284 ◽  
pp. 431-435 ◽  
Author(s):  
Alexey V. Stolbovsky ◽  
Elena Farafontova

Analysis of histograms of grain size distribution of materials nanostructured by severe plastic deformation has been carried out using statistical analysis methods. It has been established that in materials with quite homogeneous nanostructure, the fitting of histograms of grain size distribution by using a logarithmic standard distribution is not accurate enough. It is proposed to compensate for the observed imprecision by including into the model the additional component – normal distribution. It is shown that this approach is applicable to nanostructured materials with both the deformation-origin nanostructure and the grain structure formed during annealing.


1970 ◽  
Vol 2 (2) ◽  
pp. K69-K73 ◽  
Author(s):  
M. Reinbold ◽  
H. Hoffmann

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