The influence of dangling "inverted" thymidine on CD spectra and thermal stability of 2'-O-methyl RNA duplexes with RNA and DNA

2008 ◽  
Author(s):  
Daria Novopashina ◽  
Alya Venyaminova
Keyword(s):  
Thermal Stability ◽  
Cd Spectra ◽  
Rna Duplexes ◽  
Thermal Stability Of ◽  
Rna And Dna

The thermal stability of RNA duplexes containing modified base pairs placed at internal and terminal positions of the oligoribonucleotides

2002 ◽  
Vol 97 (2-3) ◽  
pp. 233-241 ◽  
Author(s):  
Krzysztof Ziomek ◽  
Elżbieta Kierzek ◽  
Ewa Biała ◽  
Ryszard Kierzek
Keyword(s):  
Thermal Stability ◽  
Base Pairs ◽  
Rna Duplexes ◽  
Thermal Stability Of

The influence of various modified nucleotides placed as 3′-dangling end on thermal stability of RNA duplexes

2002 ◽  
Vol 97 (2-3) ◽  
pp. 243-249 ◽  
Author(s):  
Krzysztof Ziomek ◽  
Elżbieta Kierzek ◽  
Ewa Biała ◽  
Ryszard Kierzek
Keyword(s):  
Thermal Stability ◽  
Modified Nucleotides ◽  
Rna Duplexes ◽  
Thermal Stability Of

Influence of N6-isopentenyladenosine (i6A) on thermal stability of RNA duplexes

2001 ◽  
Vol 91 (2) ◽  
pp. 135-140 ◽  
Author(s):  
Elżbieta Kierzek ◽  
Ryszard Kierzek
Keyword(s):  
Thermal Stability ◽  
Rna Duplexes ◽  
Thermal Stability Of

scholarly journals 4′-C-Aminoethoxy modification enhanced nuclease resistance of RNAs and improved thermal stability of RNA duplexes

2021 ◽  
pp. 100231
Author(s):  
Ryo Tsukimura ◽  
Ryohei Kajino ◽  
Yujun Zhou ◽  
Akash Chandela ◽  
Yoshihito Ueno
Keyword(s):  
Thermal Stability ◽  
Rna Duplexes ◽  
Nuclease Resistance ◽  
Thermal Stability Of

scholarly journals Stability of Enveloped and Nonenveloped Viruses in a Stable Gelatin Liquid Formulation

2022 ◽  
Author(s):  
Francois Marie Ngako Kadji ◽  
Kazuki Kotani ◽  
Hiroshi Tsukamoto ◽  
Yosuke Hiraoka ◽  
Katsuro Hagiwara
Keyword(s):  
Thermal Stability ◽  
Medical Research ◽  
Storage Period ◽  
Log10 Reduction ◽  
Liquid Formulation ◽  
Dna Viruses ◽  
The Stability ◽  
Model Virus ◽  
Thermal Stability Of ◽  
Rna And Dna

Abstract The thermal stability of relevant viruses in gelatin liquid formulations for medical research and application is poorly understood. Bovine herpesvirus (BHV) was used as a model virus to examine the molecular weight (MW), concentration and gelatin type and to optimize virus stability in liquid formulations at 25 °C and 4 °C. Using the model virus stable liquid formulation, the stability of multiple enveloped and nonenveloped RNA and DNA viruses, including parainfluenza virus (PIV), reovirus (RV), BHV, and adenovirus (AdV), was monitored over up to a 30-week storage period. The BHV model virus was considered stable after 3 weeks in hydrolyzed gelatin (MW: 4000) with a 0.8 LRV (log10 reduction value) at 25 °C or a 0.2 LRV at 4 °C, compared to the stabilities observed in higher MW gelatin (60000 and 160000) with an LRV above 1. Based on the gelatin type, BHV in B-type gelatin samples were unexpectantly more stable than in A-type gelatin sample. All four viruses exhibited stability at 4 °C for at least 8 weeks, BHV or AdV remained stable for over 30 weeks of storage, and at 25 °C, AdV and RV remained stable for 8 weeks. The results demonstrated that 5% hydrolyzed gelatin can act as a relevant stabilizer for the thermal stability of viruses in medical research and application.

The Ordered Phase Formation in Ti-Al-Ga Alloys

1970 ◽  
Vol 28 ◽  
pp. 440-441
Author(s):  
Shiro Fujishiro ◽  
Harold L. Gegel
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Titanium Alloys ◽  
Growth Kinetics ◽  
Stoichiometric Composition ◽  
Good Potential ◽  
Alpha Titanium ◽  
Cold Rolled ◽  
Kinetics Of ◽  
Thermal Stability Of

Ordered-alpha titanium alloys having a DO19 type structure have good potential for high temperature (600°C) applications, due to the thermal stability of the ordered phase and the inherent resistance to recrystallization of these alloys. Five different Ti-Al-Ga alloys consisting of equal atomic percents of aluminum and gallium solute additions up to the stoichiometric composition, Ti3(Al, Ga), were used to study the growth kinetics of the ordered phase and the nature of its interface.The alloys were homogenized in the beta region in a vacuum of about 5×10-7 torr, furnace cooled; reheated in air to 50°C below the alpha transus for hot working. The alloys were subsequently acid cleaned, annealed in vacuo, and cold rolled to about. 050 inch prior to additional homogenization

Microstructure studies of tungsten silicide schottky contacts on Gaas

1987 ◽  
Vol 45 ◽  
pp. 328-329
Author(s):  
Yih-Cheng Shih ◽  
E. L. Wilkie
Keyword(s):  
Thermal Stability ◽  
Field Effect Transistors ◽  
Schottky Contact ◽  
Schottky Contacts ◽  
Excellent Thermal Stability ◽  
Barrier Heights ◽  
Gaas Substrates ◽  
Film Adhesion ◽  
Threshold Voltages ◽  
Thermal Stability Of

Tungsten silicides (WSix) have been successfully used as the gate materials in self-aligned GaAs metal-semiconductor-field- effect transistors (MESFET). Thermal stability of the WSix/GaAs Schottky contact is of major concern since the n+ implanted source/drain regions must be annealed at high temperatures (∼ 800°C). WSi0.6 was considered the best composition to achieve good device performance due to its low stress and excellent thermal stability of the WSix/GaAs interface. The film adhesion and the uniformity in barrier heights and ideality factors of the WSi0.6 films have been improved by depositing a thin layer of pure W as the first layer on GaAs prior to WSi0.6 deposition. Recently WSi0.1 has been used successfully as the gate material in 1x10 μm GaAs FET's on the GaAs substrates which were sputter-cleaned prior to deposition. These GaAs FET's exhibited uniform threshold voltages across a 51 mm wafer with good film adhesion after annealing at 800°C for 10 min.

Thermal stability of Al-Cu-Fe icosahedral alloys

1991 ◽  
Vol 1 (12) ◽  
pp. 1823-1836 ◽  
Author(s):  
M. Bessière ◽  
A. Quivy ◽  
S. Lefebvre ◽  
J. Devaud-Rzepski ◽  
Y. Calvayrac
Keyword(s):  
Thermal Stability ◽  
Thermal Stability Of

Practical criteria for the thermal stability of a unidimensional superconductor

1994 ◽  
Vol 4 (4) ◽  
pp. 653-657
Author(s):  
B. Bonzi ◽  
M. El Khomssi ◽  
H. Lanchon-Ducauquis
Keyword(s):  
Thermal Stability ◽  
Thermal Stability Of
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