PERFORMANCE OF PSEUDOMORPHIC ULTRAVIOLET LEDs GROWN ON BULK ALUMINUM NITRIDE SUBSTRATES

2011 ◽  
Vol 20 (03) ◽  
pp. 497-504 ◽  
Author(s):  
SHAWN R. GIBB ◽  
JAMES R. GRANDUSKY ◽  
MARK MENDRICK ◽  
LEO J. SCHOWALTER

Low dislocation density pseudomorphic epitaxial layers of Al x Ga 1- x N have been grown on c -face AlN substrates prepared from high quality bulk crystals. As reported previously, pseudomorphic growth yields very low dislocation density layers with atomically smooth surfaces throughout the active region of a full LED device structure. An advantage of the low dislocation density is the ability to n -type dope the high aluminum content Al x Ga 1- x N (x ~ 70%) epitaxial layers required for UVLED devices to obtain sheet resistances less than 350 Ohm/square for 0.5 μm thick layers. Here, we report on the characterization of our pseudomorphic epitaxial AlGaN layers via cathodoluminescence (CL) and on-wafer and initial packaged level characterization of fully fabricated pseudomorphic ultraviolet LEDs (PUVLEDs) with an emission wavelength between 250 - 265 nm. An additional benefit of PUVLED devices is the ability to run these devices at high input powers and current densities. Further, the aforementioned low dislocation density of the epitaxial structure results in improved device performance over previously published data. Mean output powers of greater than 4 mW were obtained on-wafer prior to thinning and roughening while output powers as high as 45 mW were achieved for packaged devices.

2009 ◽  
Vol 1202 ◽  
Author(s):  
Shawn R. Gibb ◽  
James R. Grandusky ◽  
Yongjie Cui ◽  
Mark C. Mendrick ◽  
Leo J. Schowalter

AbstractLow dislocation density epitaxial layers of AlxGa1-xN can be grown pseudomorphically on c-face AlN substrates prepared from high quality, bulk crystals. Here, we will report on initial characterization results from deep ultraviolet (UV) light emitting diodes (LEDs) which have been fabricated and packaged from these structures. As reported previously, pseudomorphic growth and atomically smooth surfaces can be achieved for a full LED device structure with an emission wavelength between 250 nm and 280 nm.A benefit of pseudomorphic growth is the ability to run the devices at high input powers and current densities. The high aluminum content AlxGa1-xN (x∼70%) epitaxial layer can be doped n-type to obtain sheet resistances < 200 Ohms/sq/μm due to the low dislocation density. Bulk crystal growth allows for the ability to fabricate substrates of both polar and non-polar orientations. Non-polar substrates are of particular interest for nitride growth because they eliminate electric field due to spontaneous polarization and piezoelectric effects which limit device performance. Initial studies of epitaxial growth on non-polar substrates will also be presented.


2000 ◽  
Vol 639 ◽  
Author(s):  
T. Detchprohm ◽  
M. Yano ◽  
R. Nakamura ◽  
S. Sano ◽  
S. Mochiduki ◽  
...  

ABSTRACTWe have developed a new method to prepare low-dislocation-density GaN by using periodically grooved substrates in a conventional MOVPE growth technique. This new approach was demonstrated for GaN grown on periodically grooved α-Al2O3(0001), 6H-SiC(0001)Si and Si(111) substrates. Dislocation densities were 2×107 cm−2 in low-dislocation-density area.


2012 ◽  
Vol 717-720 ◽  
pp. 1179-1182 ◽  
Author(s):  
Nicolas Dheilly ◽  
Gontran Pâques ◽  
Sigo Scharnholz ◽  
Dominique Planson

This paper deals with the pulse capabilities of 4H-SiC optically triggered thyristors. The device structure and the fabrication process are presented. The results of pulse characterizations are shown. Two types of current pulses were used, a short (pulse width of 10 µs) and a long (pulse width of 650 µs). Peak current densities of 17 kA.cm-2 and 4 kA.cm-2 were attained with short and long pulses respectively. The failures and degradation caused by these experiments are also shown in this paper.


2007 ◽  
Vol 46 (1) ◽  
pp. 44-47 ◽  
Author(s):  
Feng-Jung Wu ◽  
Larry S. Simeral ◽  
Anthony A. Mrse ◽  
Jan L. Eilertsen ◽  
Lacramioara Negureanu ◽  
...  

2015 ◽  
Vol 118 (8) ◽  
pp. 085705 ◽  
Author(s):  
T. Saxena ◽  
S. Nargelas ◽  
J. Mickevičius ◽  
O. Kravcov ◽  
G. Tamulaitis ◽  
...  

2015 ◽  
Vol 23 (15) ◽  
pp. 19646 ◽  
Author(s):  
Tanuj Saxena ◽  
Michael Shur ◽  
Saulius Nargelas ◽  
Žydrūnas Podlipskas ◽  
Ramūnas Aleksiejūnas ◽  
...  

2007 ◽  
Vol 305 (2) ◽  
pp. 340-345 ◽  
Author(s):  
D.F. Storm ◽  
D.S. Katzer ◽  
J.A. Roussos ◽  
J.A. Mittereder ◽  
R. Bass ◽  
...  

2000 ◽  
Vol 640 ◽  
Author(s):  
S. E. Saddow ◽  
G. Melnychuk ◽  
M. Mynbaeva ◽  
I. Nikitina ◽  
W. M. Vetter ◽  
...  

ABSTRACTA layer of porous SiC was fabricated by surface anodization of commercial 4H and 6H-SiC (0001)Si face off-axis wafers. A 8.5 μm 4H–SiC epilayer was grown on porous SiC (PSC) substrates using atmospheric pressure CVD. TEM investigation on cross-sectional specimens of the CVD epitaxial layers revealed that the presence of pores in the substrate does not lead to the formation of any micropipe in the epitaxial layer. The investigation also failed to detect a more than usual dislocation density on the basal plane of the epitaxial layer. Based upon the results of various analytical techniques applied to the CVD deposit we propose that the density of screw dislocations in the epitaxial layer is less than 5–104 cm−3. It should be noted that the density of similar types of dislocations in the initial substrate as determined by the TEM was ∼106 cm−3, so this preliminary investigation indicates that the epitaxial layer grown on PSC may have a reduction in dislocation density of more than an order of magnitude over those grown on conventional SiC substrates that are not porous. Synchrotron white beam x-ray topography (SWBXT) was performed on these layers. Comparison between the dislocation density on the porous and standard epitaxial layers proved to be very similar using this technique.


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