NBTI and Leakage Reduction Using an Integer Linear Programming Approach

2017 ◽  
Vol 26 (11) ◽  
pp. 1750177
Author(s):  
Zhiming Yang ◽  
Yang Yu ◽  
Yue Guan ◽  
Chengcheng Zhang ◽  
Xiyuan Peng
Keyword(s):  
Linear Programming ◽  
Integer Linear Programming ◽  
Supply Voltage ◽  
Leakage Power ◽  
Vlsi Circuits ◽  
Input Vector ◽  
Programming Approach ◽  
Leakage Reduction ◽  
Bias Temperature Instability ◽  
Scale Down

As technology scales, negative bias temperature instability (NBTI) becomes one of the primary failure mechanisms for VLSI circuits. Meanwhile, the leakage power increases dramatically as the supply/threshold voltage continues to scale down. These two issues pose severe reliability problems for CMOS devices. Because both the NBTI and leakage are dependent on input vector of the circuit, we present an input vector control (IVC) method based on an integer linear programming (ILP) approach. A novel NBTI and leakage reduction criterion function as well as an ILP formulation are presented to simultaneously minimize the delay degradation and leakage power. Our proposed ILP formulation can be generated adaptively for different circuits that can help the designers find the optimal input vector conveniently. In addition, the proposed method is combined with the supply voltage assignment technique to further reduce delay degradation and leakage power. Experimental results on various circuits show the effectiveness of the proposed method.

TECHNIQUES FOR LOW LEAKAGE NANOSCALE VLSI CIRCUITS: A COMPARATIVE STUDY

2014 ◽  
Vol 23 (05) ◽  
pp. 1450061 ◽  
Author(s):  
VIJAY KUMAR SHARMA ◽  
MANISHA PATTANAIK
Keyword(s):  
Threshold Voltage ◽  
Power Dissipation ◽  
Supply Voltage ◽  
Deep Submicron ◽  
Leakage Power ◽  
Vlsi Circuits ◽  
Oxide Semiconductor ◽  
Leakage Reduction ◽  
Reduction Techniques ◽  
Leakage Power Dissipation

Since the last two decades, the trend of device miniaturization has increased to get better performance with a smaller area of the logic functions. In deep submicron regime, the demand of fabrication of nanoscale Complementary metal oxide semiconductor (CMOS) VLSI circuits has increased due to evaluation of modern successful portable systems. Leakage power dissipation and reliability issues are major concerns in deep submicron regime for VLSI chip designers. Power supply voltage has been scaled down to maintain the performance yield in future deep submicron regime. The threshold voltage is the critical parameter to trade-off the performance yield and leakage power dissipation in nanoscaled devices. Low threshold voltage improves the device characteristics with large leakage power in nanoscaled devices. Several leakage reduction techniques at different levels are used to mitigate the leakage power dissipation. Lower leakage power increases the reliability by reducing the cooling cost of the portable systems. In this article, we are presenting the explanatory general review of the commonly used leakage reduction techniques at circuit level. We have analyzed the NAND3 gate using HSPICE EDA tool for leakage power dissipation at different technology nodes in active as well as standby modes. Process, voltage and temperature effects are checked for reliability purpose. Our comparative results and discussion of different leakage reduction techniques are very useful to illustrate the effective technique in active and standby modes.

scholarly journals Analysis On Power Gating Circuits Based Low Power VLSI Circuits (BCD Adder)

2021 ◽  
Vol 2089 (1) ◽  
pp. 012080
Author(s):  
M. Srinivas ◽  
K.V. Daya Sagar
Keyword(s):  
Energy Consumption ◽  
Low Power ◽  
Power Dissipation ◽  
Supply Voltage ◽  
Oxide Thickness ◽  
Cmos Technology ◽  
Digital Circuit ◽  
Leakage Power ◽  
Vlsi Circuits ◽  
Battery Life

Abstract Currently, energy consumption in the digital circuit is a key design parameter for emerging mobile products. The principal cause of the power dissipation during idle mode is leakage currents, which are rising dramatically. Sub-threshold leakage is increased by the scaling of threshold voltage when gate current leakage increases because oxide thickness is scaled. With rising demands for mobile devices, leakage energy consumption has received even greater attention. Since a mobile device spends most of its time in standby mode, leakage power savings need to prolong the battery life. That is why low power has become a significant factor in CMOS circuit design. The required design and simulation of an AND gate with the BSIM4 MOS parameter model at 27 0C, supply voltage of 0,70V with CMOS technology of 65nm are the validation of the suitability of the proposed circuit technology. AND simulation. The performance parameters for the two AND input gate are compared with the current MTCMOS and SCCMOS techniques, such as sub-threshold leakage power dissipations in active and standby modes, the dynamic dissipation, and propagation period. The proposed hybrid super cutoff complete stack technique compared to the current MTCMOS technology shows a reduction in sub-threshold dissipation power dissipation by 3. 50x and 1.15x in standby modes and active modes respectively. The hybrid surface-cutting technique also shows savings of 2,50 and 1,04 in power dissipation at the sub-threshold in standby modes and active modes compared with the existing SCCMOS Technique.

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