scholarly journals Analysis On Power Gating Circuits Based Low Power VLSI Circuits (BCD Adder)

2021 ◽  
Vol 2089 (1) ◽  
pp. 012080
Author(s):  
M. Srinivas ◽  
K.V. Daya Sagar
Keyword(s):  
Energy Consumption ◽  
Low Power ◽  
Power Dissipation ◽  
Supply Voltage ◽  
Oxide Thickness ◽  
Cmos Technology ◽  
Digital Circuit ◽  
Leakage Power ◽  
Vlsi Circuits ◽  
Battery Life

Abstract Currently, energy consumption in the digital circuit is a key design parameter for emerging mobile products. The principal cause of the power dissipation during idle mode is leakage currents, which are rising dramatically. Sub-threshold leakage is increased by the scaling of threshold voltage when gate current leakage increases because oxide thickness is scaled. With rising demands for mobile devices, leakage energy consumption has received even greater attention. Since a mobile device spends most of its time in standby mode, leakage power savings need to prolong the battery life. That is why low power has become a significant factor in CMOS circuit design. The required design and simulation of an AND gate with the BSIM4 MOS parameter model at 27 0C, supply voltage of 0,70V with CMOS technology of 65nm are the validation of the suitability of the proposed circuit technology. AND simulation. The performance parameters for the two AND input gate are compared with the current MTCMOS and SCCMOS techniques, such as sub-threshold leakage power dissipations in active and standby modes, the dynamic dissipation, and propagation period. The proposed hybrid super cutoff complete stack technique compared to the current MTCMOS technology shows a reduction in sub-threshold dissipation power dissipation by 3. 50x and 1.15x in standby modes and active modes respectively. The hybrid surface-cutting technique also shows savings of 2,50 and 1,04 in power dissipation at the sub-threshold in standby modes and active modes compared with the existing SCCMOS Technique.

scholarly journals Low Power VLSI Design Techniques: A Review

2021 ◽  
Vol 23 (11) ◽  
pp. 172-183
Author(s):  
Ketan J. Raut ◽  
◽  
Abhijit V. Chitre ◽  
Minal S. Deshmukh ◽  
Kiran Magar ◽  
...  
Keyword(s):  
Low Power ◽  
Power Dissipation ◽  
High Speed ◽  
Vlsi Design ◽  
Cmos Technology ◽  
Vlsi Circuits ◽  
Optimization Techniques ◽  
Battery Life ◽  
Dynamic Power ◽  
Cmos Vlsi

Since CMOS technology consumes less power it is a key technology for VLSI circuit design. With technologies reaching the scale of 10 nm, static and dynamic power dissipation in CMOS VLSI circuits are major issues. Dynamic power dissipation is increased due to requirement of high speed and static power dissipation is at much higher side now a days even compared to dynamic power dissipation due to very high gate leakage current and subthreshold leakage. Low power consumption is equally important as speed in many applications since it leads to a reduction in the package cost and extended battery life. This paper surveys contemporary optimization techniques that aims low power dissipation in VLSI circuits.

scholarly journals Estimation of Leakage Power and Delay in CMOS Circuits

2020 ◽  
Vol 4 (7) ◽  
pp. 14-19
Author(s):  
Mohasinul Huq N Md ◽  
Mohan Das S ◽  
Bilal N Md
Keyword(s):  
Power Dissipation ◽  
Supply Voltage ◽  
Full Adder ◽  
Cmos Technology ◽  
Propagation Delay ◽  
Leakage Power ◽  
Nand Gate ◽  
High Threshold ◽  
Cmos Circuits ◽  
Low Leakage

This paper presents an estimation of leakage power and delay for 1-bit Full Adder (FA)designed which is based on Leakage Control Transistor (LCT) NAND gates as basic building block. The main objective is to design low leakage full adder circuit with the help of low and high threshold transistors. The simulations for the designed circuits performed in cadence virtuoso tool with 45 nm CMOS technology at a supply voltage of 0.9 Volts. Further, analysis of effect of parametric variation on leakage current and propagation delay in CMOS circuits is performed. The saving in leakage power dissipation for LCT NAND_HVT gate is up to 72.33% and 45.64% when compared to basic NAND and LCT NAND gate. Similarly for 1-bit full adder the saving is up to 90.9% and 40.08% when compared to basic NAND FA and LCT NAND.

TECHNIQUES FOR LOW LEAKAGE NANOSCALE VLSI CIRCUITS: A COMPARATIVE STUDY

2014 ◽  
Vol 23 (05) ◽  
pp. 1450061 ◽  
Author(s):  
VIJAY KUMAR SHARMA ◽  
MANISHA PATTANAIK
Keyword(s):  
Threshold Voltage ◽  
Power Dissipation ◽  
Supply Voltage ◽  
Deep Submicron ◽  
Leakage Power ◽  
Vlsi Circuits ◽  
Oxide Semiconductor ◽  
Leakage Reduction ◽  
Reduction Techniques ◽  
Leakage Power Dissipation

Since the last two decades, the trend of device miniaturization has increased to get better performance with a smaller area of the logic functions. In deep submicron regime, the demand of fabrication of nanoscale Complementary metal oxide semiconductor (CMOS) VLSI circuits has increased due to evaluation of modern successful portable systems. Leakage power dissipation and reliability issues are major concerns in deep submicron regime for VLSI chip designers. Power supply voltage has been scaled down to maintain the performance yield in future deep submicron regime. The threshold voltage is the critical parameter to trade-off the performance yield and leakage power dissipation in nanoscaled devices. Low threshold voltage improves the device characteristics with large leakage power in nanoscaled devices. Several leakage reduction techniques at different levels are used to mitigate the leakage power dissipation. Lower leakage power increases the reliability by reducing the cooling cost of the portable systems. In this article, we are presenting the explanatory general review of the commonly used leakage reduction techniques at circuit level. We have analyzed the NAND3 gate using HSPICE EDA tool for leakage power dissipation at different technology nodes in active as well as standby modes. Process, voltage and temperature effects are checked for reliability purpose. Our comparative results and discussion of different leakage reduction techniques are very useful to illustrate the effective technique in active and standby modes.

POWER REDUCTION TECHNIQUE USING MULTIPLE SUPPLY VOLTAGE AND SWITCHING ACTIVITY ANALYSIS

2013 ◽  
Vol 22 (02) ◽  
pp. 1250079
Author(s):  
BASHAR HADDAD ◽  
AMIN JARRAH
Keyword(s):  
Power Dissipation ◽  
Supply Voltage ◽  
Critical Path ◽  
Cmos Technology ◽  
Propagation Delay ◽  
Activity Analysis ◽  
Vlsi Circuits ◽  
Total Power ◽  
Switching Activity ◽  
Activity Factor

Recent demand for low power VLSI circuits has been pushing the development of innovative approaches to reduce power dissipation. Supply voltage (V CC ) and switching activity factor (α) are main sources of dynamic power dissipation in CMOS technology. Furthermore, the power dissipation increases exponentially by the value of supply voltage. New approach based on switching activity analysis and multiple supply voltage is implemented successfully in logical circuits, taking in mind the critical path(s) of the design and switching activity factor of each element in the design. High supply voltage is applied on elements on the critical path(s). Elements off the critical path(s) are classified into categories according to their switching activity factors. The total power dissipation is reduced, while the propagation delay remains without any increase. The proposed approach combines the concepts of critical/non-critical paths and switching activity analysis to assign different V CCs to different elements.

scholarly journals Robust 12T Sram Cell Using 45nm Technology

2020 ◽  
pp. 170-174
Author(s):  
N. Geetha Rani ◽  
N. Jyothi ◽  
P. Leelavathi ◽  
P. Deepthi Swarupa Rani ◽  
S. Reshma
Keyword(s):  
Power Consumption ◽  
Low Power ◽  
Power Supply ◽  
Power Dissipation ◽  
Supply Voltage ◽  
Leakage Power ◽  
Sram Cell ◽  
Static Power ◽  
Low Supply Voltage ◽  
Multi Core Processor

SRAM cells are used in many applications such as micro and multi core processor. SRAM cell improves both read stability and write ability at low supply voltage. The objective is to reduce the power dissipation of a novel low power 12T SRAM cell. This method removes half-select issue in 6T and 9T SRAM cell. This work proposes new functional low-power designs of SRAM cells with 6T, 9T and 12 transistors which operate at only 0.4V power supply in sub-threshold operation at 45 nm technology. The leakage power consumption of the proposed SRAM cell is thereby reduced compared to that of the conventional six-transistor (6T) SRAM cell. 12T cell obtains low static power dissipation.

Analytical Study Of Full Adder Circuit Using Modified Glitch Free Cascadable Adiabatic Logic

2018 ◽  
Vol 3 (2) ◽  
Author(s):  
Neha Raghav ◽  
◽  
Malti Bansal
Keyword(s):  
Power Consumption ◽  
Low Power ◽  
Power Dissipation ◽  
High Performance ◽  
Analytical Study ◽  
Supply Voltage ◽  
Full Adder ◽  
Vlsi Circuits ◽  
Low Power Consumption ◽  
Adiabatic Logic

Nowadays, power dissipation is among the most dominant concerns in designing a VLSI circuits. Endless improvement in technology has points to an increased requirement for devices which have the basic characteristic of low power consumption. Hence power has turn into a demanding design parameter in low power and high-performance applications. The Adiabatic logic technique is becoming a solution to the dilemma of power dissipation. Adders with huge power consumption affect the overall efficiency of the system. Hence, in this paper, the proposed application of full adder circuit is shown using the Modified Glitch Free Cascadable Adiabatic Logic. The circuit is compared with the conventional CMOS Logic and the power dissipation analysis is simulated with supply voltage = 0.9 V, 1.2 V and 1.8 V to analyze the pattern followed with supply variation at different temperature range. Similarly, the calculation of delay is performed for temperature values of 27˚C, 55˚C and 120˚C at 90nm technology.

scholarly journals Error-Tolerant Reconfigurable VDD 10T SRAM Architecture for IoT Applications

Electronics ◽  
2021 ◽  
Vol 10 (14) ◽  
pp. 1718
Author(s):  
Neha Gupta ◽  
Ambika Prasad Shah ◽  
Sajid Khan ◽  
Santosh Kumar Vishvakarma ◽  
Michael Waltl ◽  
...  
Keyword(s):  
Power Dissipation ◽  
Supply Voltage ◽  
Leakage Power ◽  
Functional Improvement ◽  
Scaling Technique ◽  
Iot Applications ◽  
Sram Cell ◽  
Improved Stability ◽  
Supply Voltage Scaling ◽  
Power Delay Product

This paper proposes an error-tolerant reconfigurable VDD (R-VDD) scaled SRAM architecture, which significantly reduces the read and hold power using the supply voltage scaling technique. The data-dependent low-power 10T (D2LP10T) SRAM cell is used for the R-VDD scaled architecture with the improved stability and lower power consumption. The R-VDD scaled SRAM architecture is developed to avoid unessential read and hold power using VDD scaling. In this work, the cells are implemented and analyzed considering a technologically relevant 65 nm CMOS node. We analyze the failure probability during read, write, and hold mode, which shows that the proposed D2LP10T cell exhibits the lowest failure rate compared to other existing cells. Furthermore, the D2LP10T cell design offers 1.66×, 4.0×, and 1.15× higher write, read, and hold stability, respectively, as compared to the 6T cell. Moreover, leakage power, write power-delay-product (PDP), and read PDP has been reduced by 89.96%, 80.52%, and 59.80%, respectively, compared to the 6T SRAM cell at 0.4 V supply voltage. The functional improvement becomes even more apparent when the quality factor (QF) is evaluated, which is 458× higher for the proposed design than the 6T SRAM cell at 0.4 V supply voltage. A significant improvement of power dissipation, i.e., 46.07% and 74.55%, can also be observed for the R-VDD scaled architecture compared to the conventional array for the respective read and hold operation at 0.4 V supply voltage.

scholarly journals Low Power AVLS-TSPC based 2/3 Pre-Scaler

2019 ◽  
Vol 9 (1) ◽  
pp. 6687-6693
Keyword(s):  
Low Power ◽  
High Efficiency ◽  
Supply Voltage ◽  
Low Frequency ◽  
Cmos Technology ◽  
Frequency Signal ◽  
High Frequency Signal ◽  
Power Requirement ◽  
Fast Pace ◽  
Integer Division

The technology has grown at an ultra-fast pace along with the world. Small devices with less power and high efficiency are in demand. As the circuit size gets smaller, the power requirement increases due to a greater number of transistors. A pre-scaler is a circuit which reduces the high frequency signal to a low frequency signal by integer division. A new approach to low power pre-scaler is proposed in this paper, which is an add-on to the conventional pre-scaler circuit. A true single-phase clock (TSPC) circuit reduces the skew problems in the clock and is used to realize latches and flip-flops. The objective of low power is fulfilled by incorporating the Adaptive Voltage Level Source (AVLS) to TSPC based circuit. The proposed AVLS-TSPC based pre-scaler was analyzed for a frequency of 10 MHz with a supply voltage of 1.8 V for both divide by 2 and 3 modes. The proposed pre-scaler consumes considerably lesser power when compared to that of the existing pre-scaler circuit. The circuits are implemented in 180 nm CMOS technology using Cadence Virtuoso and simulated using Cadence Spectre.

scholarly journals Comparative analysis of SRAM cell with leakage power reduction approaches

2018 ◽  
Vol 7 (2.7) ◽  
pp. 863
Author(s):  
Damarla Paradhasaradhi ◽  
Kollu Jaya Lakshmi ◽  
Yadavalli Harika ◽  
Busa Ravi Teja Sai ◽  
Golla Jayanth Krishna
Keyword(s):  
Low Power ◽  
Power Dissipation ◽  
Low Voltage ◽  
Power Saving ◽  
Vital Role ◽  
Power Reduction ◽  
Leakage Power ◽  
Access Time ◽  
Chip Area ◽  
Sram Cell

In deep sub-micron technologies, high number of transistors is mounted onto a small chip area where, SRAM plays a vital role and is considered as a major part in many VLSI ICs because of its large density of storage and very less access time. Due to the demand of low power applications the design of low power and low voltage memory is a demanding task. In these memories majority of power dissipation depends on leakage power. This paper analyzes the basic 6T SRAM cell operation. Here two different leakage power reduction approaches are introduced to apply for basic 6T SRAM. The performance analysis of basic SRAM cell, SRAM cell using drowsy-cache approach and SRAM cell using clamping diode are designed at 130nm using Mentor Graphics IC Studio tool. The proposed SRAM cell using clamping diode proves to be a better power reduction technique in terms of power as compared with others SRAM structures. At 3.3V, power saving by the proposed SRAM cell is 20% less than associated to basic 6T SRAM Cell.

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