Characterization of a New Cleaning Method Using Electrolytic Ionized Water for Polysilicon Chemical Mechanical Polishing Process

Mechanical Polishing ◽

Polishing Process ◽

Cleaning Method ◽

Ellipsometry characterization of oxidized copper layers for chemical mechanical polishing process

Thin Solid Films ◽

10.1016/j.tsf.2004.01.021 ◽

2004 ◽

Vol 455-456 ◽

pp. 491-494 ◽

Cited By ~ 8

Author(s):

H. Nishizawa ◽

Y. Tateyama ◽

T. Saitoh

Keyword(s):

Mechanical Polishing ◽

Polishing Process ◽

Fabrication of ruthenium thin film and characterization of its chemical mechanical polishing process

Materials Chemistry and Physics ◽

10.1016/j.matchemphys.2015.06.017 ◽

2015 ◽

Vol 162 ◽

pp. 477-486 ◽

Cited By ~ 11

Author(s):

Yi-Sin Chou ◽

Shi-Chern Yen ◽

King-Tsai Jeng

Keyword(s):

Thin Film ◽

Mechanical Polishing ◽

Polishing Process ◽

Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena ◽

Characterization of scratches generated by a multiplaten copper chemical–mechanical polishing process

10.1116/1.1634958 ◽

2004 ◽

Vol 22 (1) ◽

pp. 65 ◽

Cited By ~ 13

Author(s):

T. Y. Teo ◽

W. L. Goh ◽

V. S. K. Lim ◽

L. S. Leong ◽

T. Y. Tse ◽

...

Keyword(s):

Mechanical Polishing ◽

Polishing Process ◽

Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena ◽

Fabrication and characterization of silicon field emitter arrays with focusing electrode by the chemical mechanical polishing process

10.1116/1.589911 ◽

1998 ◽

Vol 16 (2) ◽

pp. 811 ◽

Cited By ~ 10

Author(s):

Jin Ho Lee

Keyword(s):

Mechanical Polishing ◽

Polishing Process ◽

Field Emitter ◽

Field Emitter Arrays ◽

Chemical Mechanical Polishing Process ◽

Fabrication And Characterization

Characterization of the Chemical‐Mechanical Polishing Process Based on Nanoindentation Measurement of Dielectric Films

Journal of The Electrochemical Society ◽

10.1149/1.2048695 ◽

1995 ◽

Vol 142 (9) ◽

pp. 3098-3104 ◽

Cited By ~ 12

Author(s):

Chi‐Wen Liu ◽

Bau‐Tong Dai ◽

Ching‐Fa Yeh

Keyword(s):

Mechanical Polishing ◽

Dielectric Films ◽

Polishing Process ◽

Nanoindentation Measurement ◽

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena ◽

Effect of temperature on copper damascene chemical mechanical polishing process

10.1116/1.2825143 ◽

2008 ◽

Vol 26 (1) ◽

pp. 141 ◽

Cited By ~ 13

Author(s):

Veera Raghava Kakireddy ◽

Subrahmanya Mudhivarthi ◽

Ashok Kumar

Keyword(s):

Mechanical Polishing ◽

Effect Of Temperature ◽

Polishing Process ◽

Integrated Tungsten Chemical Mechanical Polishing Process Characterization for Via Plug Interconnection in Ultralarge Scale Integrated Circuits

Japanese Journal of Applied Physics ◽

10.1143/jjap.41.5120 ◽

2002 ◽

Vol 41 (Part 1, No. 8) ◽

pp. 5120-5124 ◽

Cited By ~ 5

Author(s):

Chin-Kun Wang ◽

Hua-Shu Wu ◽

Nai-Tien Ou ◽

Huang-Chung Cheng

Keyword(s):

Integrated Circuits ◽

Mechanical Polishing ◽

Polishing Process ◽

Process Characterization ◽

Applications of Taguchi and design of experiments methods in optimization of chemical mechanical polishing process parameters

The International Journal of Advanced Manufacturing Technology ◽

10.1007/s00170-007-1124-7 ◽

2007 ◽

Vol 38 (7-8) ◽

pp. 674-682 ◽

Cited By ~ 36

Author(s):

Hsin-Te Liao ◽

Jie-Ren Shie ◽

Yung-Kuang Yang

Keyword(s):

Design Of Experiments ◽

Process Parameters ◽

Mechanical Polishing ◽

Polishing Process ◽

Ultrafiltration based on various polymeric membranes for recovery of spent tungsten slurry for reuse in chemical mechanical polishing process

Journal of Membrane Science ◽

10.1016/j.memsci.2017.11.034 ◽

2018 ◽

Vol 548 ◽

pp. 232-238 ◽

Cited By ~ 2

Author(s):

Nur Fatin Amalina Muhammad Sanusi ◽

Mohd Hizami Mohd Yusoff ◽

Ooi Boon Seng ◽

Mohd Sabirin Marzuki ◽

Ahmad Zuhairi Abdullah

Keyword(s):

Polymeric Membranes ◽

Mechanical Polishing ◽

Polishing Process ◽

A Dynamic Thermal Modeling of Chemical Mechanical Polishing Process

Transactions of the Korean Society of Mechanical Engineers A ◽

10.3795/ksme-a.2004.28.5.617 ◽

2004 ◽

Vol 28 (5) ◽

pp. 617-623

Keyword(s):

Thermal Modeling ◽

Mechanical Polishing ◽

Polishing Process ◽