Integrated Tungsten Chemical Mechanical Polishing Process Characterization for Via Plug Interconnection in Ultralarge Scale Integrated Circuits

Japanese Journal of Applied Physics ◽

10.1143/jjap.41.5120 ◽

2002 ◽

Vol 41 (Part 1, No. 8) ◽

pp. 5120-5124 ◽

Author(s):

Chin-Kun Wang ◽

Hua-Shu Wu ◽

Nai-Tien Ou ◽

Huang-Chung Cheng

Keyword(s):

Integrated Circuits ◽

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Polishing Process ◽

Process Characterization ◽

Chemical Mechanical Polishing Process

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Polysilicon chemical-mechanical polishing process characterization using a non-contact capacitance probe technique

10.1063/1.1354435 ◽

2001 ◽

Author(s):

Dale L. Hetherington

Keyword(s):

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Polishing Process ◽

Probe Technique ◽

Process Characterization ◽

Chemical Mechanical Polishing Process ◽

Capacitance Probe

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Effect of temperature on copper damascene chemical mechanical polishing process

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena ◽

10.1116/1.2825143 ◽

2008 ◽

Vol 26 (1) ◽

pp. 141 ◽

Author(s):

Veera Raghava Kakireddy ◽

Subrahmanya Mudhivarthi ◽

Ashok Kumar

Keyword(s):

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Effect Of Temperature ◽

Polishing Process ◽

Chemical Mechanical Polishing Process

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Characterization of a New Cleaning Method Using Electrolytic Ionized Water for Polysilicon Chemical Mechanical Polishing Process

Japanese Journal of Applied Physics ◽

10.1143/jjap.41.5098 ◽

2002 ◽

Vol 41 (Part 1, No. 8) ◽

pp. 5098-5103 ◽

Author(s):

Naoto Miyashita ◽

Shin-ichiro Uekusa ◽

Hiroshi Katumata

Keyword(s):

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Polishing Process ◽

Cleaning Method ◽

Chemical Mechanical Polishing Process

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Applications of Taguchi and design of experiments methods in optimization of chemical mechanical polishing process parameters

The International Journal of Advanced Manufacturing Technology ◽

10.1007/s00170-007-1124-7 ◽

2007 ◽

Vol 38 (7-8) ◽

pp. 674-682 ◽

Author(s):

Hsin-Te Liao ◽

Jie-Ren Shie ◽

Yung-Kuang Yang

Keyword(s):

Design Of Experiments ◽

Process Parameters ◽

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Polishing Process ◽

Chemical Mechanical Polishing Process

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Ultrafiltration based on various polymeric membranes for recovery of spent tungsten slurry for reuse in chemical mechanical polishing process

Journal of Membrane Science ◽

10.1016/j.memsci.2017.11.034 ◽

2018 ◽

Vol 548 ◽

pp. 232-238 ◽

Author(s):

Nur Fatin Amalina Muhammad Sanusi ◽

Mohd Hizami Mohd Yusoff ◽

Ooi Boon Seng ◽

Mohd Sabirin Marzuki ◽

Ahmad Zuhairi Abdullah

Keyword(s):

Chemical Mechanical Polishing ◽

Polymeric Membranes ◽

Mechanical Polishing ◽

Polishing Process ◽

Chemical Mechanical Polishing Process

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A Dynamic Thermal Modeling of Chemical Mechanical Polishing Process

Transactions of the Korean Society of Mechanical Engineers A ◽

10.3795/ksme-a.2004.28.5.617 ◽

2004 ◽

Vol 28 (5) ◽

pp. 617-623

Keyword(s):

Chemical Mechanical Polishing ◽

Thermal Modeling ◽

Mechanical Polishing ◽

Polishing Process ◽

Chemical Mechanical Polishing Process

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Removal of scratch on the surface of MgO single crystal substrate in chemical mechanical polishing process

Applied Surface Science ◽

10.1016/j.apsusc.2008.01.150 ◽

2008 ◽

Vol 254 (15) ◽

pp. 4856-4863 ◽

Author(s):

R.K. Kang ◽

K. Wang ◽

J. Wang ◽

D.M. Guo

Keyword(s):

Single Crystal ◽

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Single Crystal Substrate ◽

Polishing Process ◽

Crystal Substrate ◽

Chemical Mechanical Polishing Process

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Indium Tin Oxide Film Characteristics after Chemical Mechanical Polishing Process with Control of Pad Conditioning Temperature

Solid State Phenomena - Advances in Nanomaterials and Processing ◽

10.4028/3-908451-31-0.263 ◽

2007 ◽

pp. 263-266

Author(s):

Nam Hoon Kim ◽

Gwon Woo Choi ◽

Yong Jin Seo ◽

Woo Sun Lee

Keyword(s):

Tin Oxide ◽

Indium Tin Oxide ◽

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Polishing Process ◽

Conditioning Temperature ◽

Chemical Mechanical Polishing Process ◽

Pad Conditioning ◽

Film Characteristics

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3-D Model of Wafer Topography's Effect on Chemical Mechanical Polishing Process

ECS Meeting Abstracts ◽

10.1149/ma2009-02/22/1992 ◽

2009 ◽

Keyword(s):

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Polishing Process ◽

Chemical Mechanical Polishing Process ◽

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Study on Groove Shape of CMP Polishing Pad: A Review

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.497.278 ◽

2012 ◽

Vol 497 ◽

pp. 278-283 ◽

Author(s):

Chun Lan Lou ◽

Hai Yan Di ◽

Qiang Fang ◽

Tao Kong ◽

Wei Feng Yao ◽

...

Keyword(s):

Research And Development ◽

Chemical Mechanical Polishing ◽

Review Paper ◽

Mechanical Polishing ◽

Polishing Process ◽

Critical Elements ◽

Comprehensive View ◽

Groove Shape ◽

Polishing Pad ◽

Chemical Mechanical Polishing Process

In the chemical mechanical polishing process (CMP) ，the groove shape of polishing pad is one of the most critical elements that directly influences the quality and efficiency of CMP. This review paper describes the basic patterns of groove shape and that the patterns shape of polishing pad how to effect on quality and efficiency of CMP. The effect comparison between various sorts of groove shape and their effects on polishing is described. It is intended to help reader to gain a more comprehensive view on groove shape of polishing pad, and to be instrumental for research and development new groove shape of polishing pad for CMP.

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