Thermal-aware logic block placement for 3D FPGAs considering lateral heat dissipation (abstract only)

2012 ◽  
Author(s):  
Juinn-Dar Huang ◽  
Ya-Shih Huang ◽  
Mi-Yu Hsu ◽  
Han-Yuan Chang
Keyword(s):  
Heat Dissipation ◽  
Logic Block ◽  
Block Placement ◽  
Lateral Heat

scholarly journals Investigation of Production of Nanofiber Nonwoven Fabric and its Thermal Properties

2020 ◽  
Vol 14 (2) ◽  
pp. 264-273
Author(s):  
Wei Wu ◽  
Kenichi Urabe ◽  
Toshiki Hirogaki ◽  
Eiichi Aoyama ◽  
Hiroyoshi Sota ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Thermal Characteristics ◽  
Nonwoven Fabric ◽  
Melt Blowing ◽  
One Dimensional ◽  
Manufacturing Method ◽  
Apparent Thermal Conductivity ◽  
Computational Fluid Dynamics Cfd ◽  
Lateral Heat

Nanofibers of polypropylene were produced by a modified melt-blowing method. The manufacturing method and thermal characteristics of fabricated nonwoven-fabric nanofibers were studied. Apparent thermal conductivity was measured as an evaluation of adiabatic properties, and a prediction model was developed with computational fluid dynamics (CFD) based on a one-dimensional computer-aided engineering method. In addition, we attempted to evaluate true thermal conductivity in consideration of lateral heat dissipation during measurement by thickness. Consequently, we determined the influence of the fiber diameter and thickness of the nonwoven fabric on the thermal conductivity and demonstrated that the proposed CFD model was effective for estimating the characteristics of the thermal conductivity of the nonwoven fabric.

Enhanced lateral heat dissipation packaging structure for GaN HEMTs on Si substrate

2013 ◽  
Vol 51 (1-2) ◽  
pp. 20-24 ◽  
Author(s):  
Stone Cheng ◽  
Po-Chien Chou ◽  
Wei-Hua Chieng ◽  
E.Y. Chang
Keyword(s):  
Heat Dissipation ◽  
Si Substrate ◽  
Gan Hemts ◽  
Packaging Structure ◽  
Lateral Heat

Experimental Demonstration of Thermal Management of High-Power GaN Transistors with Graphene Lateral Heat Spreaders

2011 ◽  
Vol 1344 ◽  
Author(s):  
Zhong Yan ◽  
Guanxiong Liu ◽  
Javed Khan ◽  
Jie Yu ◽  
Samia Subrina ◽  
...  
Keyword(s):  
Thermal Management ◽  
High Power ◽  
Heat Dissipation ◽  
Local Temperature ◽  
Heat Spreader ◽  
Heat Spreaders ◽  
Device Structures ◽  
Graphene Flakes ◽  
Lateral Heat

ABSTRACTGraphene is a promising candidate material for thermal management of high-power electronics owing to its high intrinsic thermal conductivity. Here we report preliminary results of the proof-of-concept demonstration of graphene lateral heat spreaders. Graphene flakes were transferred on top of GaN devices through the mechanical exfoliation method. The temperature rise in the GaN device channels was monitored in-situ using micro-Raman spectroscopy. The local temperature was measured from the shift in the Raman peak positions. By comparing Raman spectra of GaN devices with and without graphene heat spreader, we demonstrated that graphene lateral heat spreaders effectively reduced the local temperature by ~ 20oC for a given dissipated power density. Numerical simulation of heat dissipation in the considered device structures gave results consistent with the experimental data.

Improved lateral heat spreading performance for polyvinylidene fluoride composite film comprising silver nanowire in light-emitting diode

RSC Advances ◽  
2016 ◽  
Vol 6 (42) ◽  
pp. 35884-35891 ◽  
Author(s):  
Zhao Li ◽  
Li Zhang ◽  
Rong Qi ◽  
Fan Xie ◽  
Shuhua Qi
Keyword(s):  
Heat Sink ◽  
Polyvinylidene Fluoride ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Silver Nanowire ◽  
Transfer Property ◽  
Light Emitting ◽  
Thermal Transfer ◽  
Heat Spreading ◽  
Lateral Heat

Silver nanowire (AgNW) attracts great attention as a heat dissipation material due to its excellent thermal transfer property which exceeds most traditional heat sink materials.

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