Characterization of High Efficient Red Phosphorescent OLEDs Fabricated on Flexible Substrates

2019 ◽  
Vol 1 (35) ◽  
pp. 7-10 ◽  
Author(s):  
Sunghyun Kim ◽  
Yoo Jin Lee ◽  
Ki Nam Byun ◽  
Bum-Sung Lee ◽  
Sang-Yun Jung ◽  
...  
Keyword(s):  
Flexible Substrates ◽  
High Efficient

scholarly journals The Characterization of Spin Coated ZnO TCO on the Flexible Substrates

2012 ◽  
Vol 25 (4) ◽  
pp. 290-293
Author(s):  
Min-Chul Jun ◽  
Ku-Tak Lee ◽  
Sang-Uk Park ◽  
Kyung-Ju Lee ◽  
Byung-Moo Moon ◽  
...  
Keyword(s):  
Flexible Substrates

Fabrication and characterization of CdTe nano pattern on flexible substrates by nano imprinting and electrodeposition

2010 ◽  
Vol 87 (11) ◽  
pp. 2097-2102 ◽  
Author(s):  
Seungju Chun ◽  
Kang-Soo Han ◽  
Ju-Hyeon Shin ◽  
Heon Lee ◽  
Donghwan Kim
Keyword(s):  
Flexible Substrates ◽  
Fabrication And Characterization

Fabrication and Characterization of Flexible Substrates for Use in the Development of Miniaturized Wireless Sensor Network Modules

2005 ◽  
Vol 128 (3) ◽  
pp. 236-245 ◽  
Author(s):  
Bivragh Majeed ◽  
Kieran Delaney ◽  
John Barton ◽  
Niall McCarthy ◽  
Sean C. O’Mathuna ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Flexible Substrate ◽  
Wireless Sensor ◽  
Polymer Support ◽  
Flexible Substrates ◽  
Dramatic Decrease ◽  
Support Ring ◽  
Network Modules ◽  
Fabrication And Characterization

In this paper we describe the materials-related challenges in applying folded flex packaging technology to wireless sensor networks and propose solutions for implementing miniaturized 5mm cube platforms. The focus is to apply thin silicon stacking methods using thin flexible substrate interconnect and in particular to investigate the behavior of the selected materials. Both commercial and in-house polyimide substrates, in the thickness range 25μm down to 3μm (each with 4μm of sputtered copper) were analyzed for appropriate electrical, chemical, and mechanical properties. The characterization highlighted that in flex of thickness below 10μm, a dramatic decrease in stiffness occurs and the polyimide wrinkles due to stresses generated by the copper sputtering process. An evaluation determined that specific steps, such as polymer support ring formation, could be employed to eliminate impact of wrinkling on the process of developing the 5mm cube prototypes.

Preparation and characterization of ZnTe as an interlayer for CdS/CdTe substrate thin film solar cells on flexible substrates

2013 ◽  
Vol 535 ◽  
pp. 202-205 ◽  
Author(s):  
Xianjin Feng ◽  
Kartikay Singh ◽  
Sushma Bhavanam ◽  
Vasilios Palekis ◽  
Don L. Morel ◽  
...  
Keyword(s):  
Thin Film ◽  
Solar Cells ◽  
Thin Film Solar Cells ◽  
Flexible Substrates ◽  
Cdte Substrate
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