Controlling Whisker Formation in Tin-Based Solders Using Electrically Mediated Electrodeposition

2019 ◽  
Vol 6 (8) ◽  
pp. 153-163 ◽  
Author(s):  
Holly Garich ◽  
Heather McCrabb ◽  
E. Jennings Taylor ◽  
Maria Inman
Keyword(s):  
Whisker Formation

Whisker Formation in Copper Electroplating

2011 ◽  
Author(s):  
Theresa Han ◽  
Eunin Cho ◽  
Jinwoo Heo ◽  
Seoung Jae Lee
Keyword(s):  
Copper Sulfate ◽  
Surface Stress ◽  
Whisker Formation ◽  
Printed Wiring Boards ◽  
Copper Electroplating ◽  
Cu Electroplating ◽  
Solution Surface ◽  
Dry Film

Abstract In the manufacture of Printed Wiring Boards (PWB), unwelcome structures, such as nodules and whiskers can be formed during copper electroplating with copper sulfate. Copper (Cu) whiskers with lengths of up to a few hundred micrometers can lead to electrical shorts between layers or patterns. In this paper, we document factors that can affect the growth of Cu whiskers; decomposition of additives in the Cu electroplating solution, surface stress, acidic cleaner, and the ingredients of a dry film. Contaminants from outside of the electroplating bath and the ingredients of the dry film were shown as key components in the formation of Cu whiskers.

scholarly journals Whisker Formation in Porosity in Al Alloys

2016 ◽  
Vol 47 (6) ◽  
pp. 3459-3468 ◽  
Author(s):  
William David Griffiths ◽  
Ahmed Elsayed ◽  
Mahmoud Ahmed El-Sayed
Keyword(s):  
Al Alloys ◽  
Whisker Formation

Effect of Creep Properties on Pressure Induced Tin Whisker Formation

2008 ◽  
Author(s):  
Tadahiro Shibutani ◽  
Qiang Yu ◽  
Masaki Shiratori
Keyword(s):  
Whisker Formation ◽  
Tin Whisker ◽  
Creep Properties

Whisker formation on a thin film tin lithium-ion battery anode

2011 ◽  
Vol 196 (3) ◽  
pp. 1474-1477 ◽  
Author(s):  
Juchuan Li ◽  
Fuqian Yang ◽  
Jia Ye ◽  
Yang-Tse Cheng
Keyword(s):  
Thin Film ◽  
Lithium Ion Battery ◽  
Lithium Ion ◽  
Whisker Formation ◽  
Battery Anode

Microstructure evolution and microimpact performance of Sn–Ag–Cu solder joints under thermal cycle test

2010 ◽  
Vol 25 (7) ◽  
pp. 1312-1320 ◽  
Author(s):  
Y.L. Huang ◽  
K.L. Lin ◽  
D.S. Liu
Keyword(s):  
Fracture Energy ◽  
Microstructure Evolution ◽  
Thermal Cycle ◽  
Fracture Behavior ◽  
Solder Ball ◽  
Solder Joints ◽  
Whisker Formation ◽  
Structural Variations ◽  
Before And After ◽  
Ball Joints

The microstructure and microimpact performance of Sn1Ag0.1Cu0.02Ni0.05In (SAC101NiIn)/AuNi/Cu solder ball joints were investigated after a thermal cycle test (TCT). The joints show complete bulk fracture behavior before TCT. Moreover, TCT facilitated interfacial fracture behavior with lower fracture energy. The intermetallic compounds (IMCs) formed in the solder joints before and after TCT were investigated. TCT induces a variety of structural variations in the solder joints, including slipping bands, whisker formation, the squeezing of the IMC layer, the formation of cavities, the rotation and pop-up of grain, and the deformation and rotation of the entire joint. The variations in fracture behavior induced by TCT are correlated with the structural variations in the solder joints.

scholarly journals Spontaneous Ga whisker formation on FeGa3

2018 ◽  
Vol 28 (5) ◽  
pp. 569-574
Author(s):  
Yushuang Liu ◽  
Peigen Zhang ◽  
Li Yang ◽  
Wubian Tian ◽  
Yamei Zhang ◽  
...  
Keyword(s):  
Whisker Formation
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